To develop and optimize AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines, and to support customer and internal quality requirements.
Job
• Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes
• Operate and optimize 2D/3D AOI systems and inspection parameters
• Configure AOI inspection algorithms for new product designs
• Set up process conditions and equipment configurations for new packages and production lines
• Optimize reflow parameters and temperature profiles
• Analyze solder/micro bump quality and implement improvements
• Conduct root cause analysis and implement corrective actions for process issues
• Support customer quality requirements through technical evaluation and documentation
• Supports mass production and quality control in the advanced semiconductor packaging process
• Contributes to defect reduction, process stability, and customer satisfaction
• Drives yield and reliability improvements in AOI and reflow process areas
Requirement:
• Bachelor’s degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)
• Minimum 3 years of experience in AOI or reflow process in semiconductor backend
• Ability to establish process conditions and optimize parameters
• Strong data analysis and problem-solving skills
• Knowledge of inspection or reflow/soldering principles
• Experience in defect analysis and developing defect evaluation criteria
• Required experience with bump and RDL inspection
• Basic understanding of thermal, electrical, and material behavior in reflow processes
• Experience in advanced packaging process such as 2.5D, fan-out and flip-chip
• Familiarity with quality tools such as APQP, FMEA and 8D methodology
• Experience in responding to customer quality requirements or certification audits
• Ability to write technical documentation and communicate in English
• Hand-on experience with major AOI equipment(e.g., KLA, onto, Camtek)
• Collaborative experience in AOI image analysis and algorithm development
• Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids.
• Experience in quality and reliability evaluation related to reflow or soldering processes
• Understanding of associated assembly/joining processes (eg. Bonding, chip attach)
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:
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