As a Die Fab Operator at Nokia, you will play a pivotal role in our cutting-edge cleanroom team, focused on processing optoelectronic devices. You'll work closely with engineers and management to ensure the quality and efficiency of semiconductor wafers and Photonic Integrated Circuits (PICs). Your day-to-day responsibilities will involve meticulous inspection of materials, precision cleaving of wafers, and operating advanced evaporation tools to apply antireflective coatings. In our dynamic, collaborative environment, you'll contribute to groundbreaking technology while adhering to strict safety and cleanliness protocols. With each task, you'll have the opportunity to make an immediate impact on product quality and innovation. The culture values proactive communication, allowing you to share insights and unexpected findings with your team. You'll be integral to our mission of delivering high-quality optoelectronic solutions that shape the future of connectivity.
This position is for shift 5 - 6:00 PM to 6:00 AM, Monday - Wednesday and every other Thursday.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile, and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Advanced connectivity is key to enable the opportunities of AI – opening new doors for us and our customers. Once known for connecting people, our technology is now essential to connecting intelligence.
Our priority is to deliver superior performance with the trust and security our customers need and we’re a committed innovation partner, shaping the future of connectivity.
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