Winbond

(竹北)Security記憶體產品工程師

Winbond  •  Onsite  •  3 months ago
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Job Description

【工作內容】
作為華邦的(竹北)Security記憶體產品工程師,你將運用程式語言協助產品工程師分析失效率及問題來源,致力於提供符合客戶需求的精良產品。工作內容包含:

  1. 新產品驗證與量產導入
  2. 產品良率及品質改善
  3. 產品工程的協調者與溝通窗口
  4. 客戶退貨分析支援


【條件要求】
學歷要求:大學
科系要求:數學及電算機科學學科類(全部)
相關經驗:3年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:

1.具2年以上NVM產品驗證經驗 (確認產品符合設計規格,並解決異常事件;可協調團隊完成驗證項目)或2年以上量產經驗
2.熟悉半導體製程 (有NVM製程經驗尤佳)
3.熱衷於學習新技術
4.良好的跨部門溝通與合作
5.常需與國外單位開會,須具備基礎英文溝通能力


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Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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