Job Description

Section Manager - Process Engineering

Location: Near BTS Bearing, Bangkok

Employment Type: Permanent

Experience: 7-10 years

Salary: Open, depending on experience

Relocation: Expatriate candidates welcome, with
relocation support

About the Role

Our client is
seeking a Section Manager to lead a team of engineers responsible for
semiconductor assembly and advanced packaging processes.

The position will
oversee engineering performance, technical projects, process improvement and
team development. The successful candidate will have strong semiconductor
process knowledge, proven people-management experience and the ability to
deliver engineering projects across multiple stakeholders.

Relevant
technologies include Power QFN, Cu Clip, SiP, flip chip, wire bonding and
molding.

Responsibilities

• Lead, supervise and develop a
  team of process and manufacturing engineers.
• Set team priorities and
  ensure alignment with production, quality and business objectives.
• Oversee semiconductor
  assembly and advanced-packaging engineering activities.
• Manage engineering projects
  covering yield improvement, quality, capacity, equipment efficiency and
  cost reduction.
• Plan project scope,
  resources, schedules and budgets.
• Drive process improvement
  across Power QFN, Cu Clip, SiP, flip chip, wire bonding and molding
  operations.
• Implement FMEA, SPC, control
  charts, DOE, 8D and other advanced quality tools.
• Review process performance,
  engineering data, yield losses and production abnormalities.
• Ensure effective root-cause
  analysis and implementation of corrective and preventive actions.
• Support new product
  introduction, process qualification, technology transfer and
  mass-production ramp-up.
• Collaborate with Production,
  Quality, Equipment, Product Engineering, R&D and commercial teams.
• Ensure processes meet
  customer, automotive, quality and regulatory requirements.
• Act as a senior technical
  interface for customers and overseas stakeholders.
• Coach engineers, conduct
  performance reviews and develop succession and technical-training plans.
• Promote engineering
  standards, continuous improvement and knowledge sharing.
• Ensure projects are delivered
  within agreed scope, schedule and budget.

Requirements

• Bachelor's or Master's degree
  in Engineering or a related technical discipline.
• Approximately 7-10 years of
  semiconductor assembly, packaging or OSAT experience.
• Previous experience leading
  engineers, supervisors or technical project teams.
• Advanced knowledge of several
  of the following:
• Power QFN and Cu Clip
• PMOS or MOSFET packaging
• SiP or System-in-Package
• Flip chip
• Wire bonding
• Molding and encapsulation
• Direct experience in Cu Clip,
  Power QFN or power-semiconductor packaging would be highly advantageous.
• Proven record of improving
  manufacturing yield, quality, productivity or cost.
• Strong knowledge of FMEA,
  SPC, DOE, 8D and control-chart methodologies.
• Experience managing
  engineering projects involving multiple functions and stakeholders.
• Strong leadership, coaching
  and performance-management skills.
• Knowledge of automotive
  semiconductor quality requirements would be advantageous.
• PMP certification or
  equivalent project-management training is preferred.
• Strong communication and
  technical presentation skills.
• Working English is required
  for expatriate candidates.
• Open to candidates requiring
  relocation to Thailand.