Job Description

SCE Product Engineer

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets.

Business Line Description

NXP’s Secure Connected Edge business line offers high-performance multicore solutions that transport, analyze and secure data from the edge of the network to the cloud.

Scope of Responsibilities:
This is a Product Engineering position in the Secure Connected Edge (SCE) Business Line. Working on New Production Introduction of highly integrated, multi core processors and controllers to ensure that the quality, cost, and schedule needs of our customers are met.

Responsibilities:

• Work with global cross-functional teams on SCE Edge MPU’s new product through the entire NPI development cycle (Concept, definition, execution, product launch/ramp).
• Translates product specification and system requirements into test requirements and coverage methods (Trace Matrix)
• Support development of ATE test hardware requirements and review schematics and plots for probe card and device interface board.
• Drive Cost Reduction: Test Time Reduction and Yield Improvement.
• Perform yield enhancement by identifying fail modes, quantity of material affected, fallout rate, etc.
• Responsible for qualifying new product introduction and helping to drive to root cause for any qual failures in timely manner.
• Characterization(CZ) activities – Defining matrix lots, generating CZ flow, ATE CZ data collection, performing bench measurements, micro probing, thermal evaluation, data analysis, presenting and generating reports.
• Perform ATE data collection and failure characterization to determine the failure mechanism(s).
• Assist with Customer Quality Incident investigations (ATE test, lab analysis and failure analysis support)
• Generate technical documentation such as statistical analysis report, evaluation summary report, lessons learned.
• Perform manual bench ESD and latch up test and identify the root cause of failures. Propose solutions working with design engineers.
• Assist in correlating critical ATE parametric measurements correlate with lab measurements.
• Help drive new innovative solutions and methodologies to improve cycle time and cost.
• Help transfer production test program releases to manufacturing.
• Own and manage PE deliverables working with global cross functional teams.

Job Qualifications:

o Bachelor or Master’s degree in Electronics, Electrical, Computer Engineering or relevant disciplines.

o Minimum 5 years of relevant experience in product and test engineering.

o Strong written and verbal communication skills

o Self-motivated. Able to plan, execute and deliver within given timeline.

o Solid knowledge of integrated circuits in CMOS, SOI and FinFET technologies.

o Test program debugging skills on ATE i.e. Teradyne or Agilent 93K.

o Basic skills in statistics. JMP software scripting a plus.

o Good software skills (C, C++). Linux, Python and Visual Basic a plus.

o Familiar with BIST, SCAN, DFT, DFA implementation schemes is a plus

o Strong team player with leadership, negotiation and collaboration skills.

o Strong problem solving skills

Job Location: ATKL, Malaysia

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