We are a leading company in the wireless broadband communications industry looking for talented professionals with a winning attitude.
1. SiP 模組封裝製程開發與導入
參與 SiP（System in Package）模組之封裝製程開發、優化與量產導入包含 SMT、Die attach、Wire bonding、Underfill、Molding、Lid Shielding 等關鍵製程
2. 新材料、新設備與新技術評估
評估封裝相關新材料（如 underfill、solder、adhesive）與新設備之製程適用性協助建立製程 window、規格與量產條件
3. 製程問題分析與改善
協助分析封裝製程異常（如 short / open / warpage / reliability issue）透過 DOE、失效分析（FA）、量測數據進行 root cause 分析與改善方案提出
4.跨部門與跨廠區技術整合
與設計、品質、設備、材料及海外工廠團隊合作，確保製程可行性與穩定度協助新製程 新材料於不同廠區的導入與驗證
Education
Work Experience
Language
Skills
Batch Production、 Electronics Packaging、 Failure Analysis、 Failure Mode And Effects Analysis、 ISO/TS 16949 Technical Specification、 ISO 9000、 Measurement Systems Analysis (MSA)、 Multi-Processing Modules、 Process Development (PD)、 Process Flow Diagrams (PFDs)、 Process Simulation、 Process Specification、 Semiconductor Device Physics、 SMT Production Engineering、 Statistical Analysis、 Statistical Process Control (SPC)、 Technical Documents、 Validation Processes、 VDA 6.1 Standard
WNC Corporation is a leading network communications solutions provider headquartered in Hsinchu, Taiwan. WNC has additional manufacturing facilities and sales offices in North America, Europe and Asia, and a workforce of over 14,000 employees worldwide. WNC provides a whole range of communications solutions covering Wi-Fi, 5G, LEO satellite broadband, fixed broadband, high-speed switches, edge infrastructure, IoT, and automotive technologies (including infotainment, telematics, ADAS and edge computing). Leveraging its expertise in antenna/RF design and system integration, WNC is a key supplier to networking brands, tier-1 telecoms, MSO and smart home operators, and automotive customers.
