Job Description

Reliability and Materials Development Engineer

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Reliability and Materials Development Engineer

As a Specialist Reliability Engineer for the Liquid Cooling Solutions Business, you will play a pivotal role in developing, validating, and scaling reliability solutions for cutting-edge thermal interface materials (TIM), multi-chip modules (MCM), and system integration projects. You will collaborate with cross-functional teams to ensure that reliability strategies are embedded throughout the product lifecycle, from concept to manufacturing scale-up.

Key Responsibilities

• Lead or support reliability testing, failure analysis, and root cause investigations for new materials, assemblies, and system designs.

• Develop and test materials and products for given applications; including feedback to mechanical design and impact on material selection and joint design.

• Collaborate with design, process, and manufacturing teams to integrate reliability best practices into development and scale-up activities.

• Plan and execute reliability test campaigns, including environmental, thermal cycling, and system-level validation, using custom HP test tools and industry-standard methodologies.

• Analyze test data, interpret results, and provide actionable recommendations to improve product robustness and performance.

• Document and communicate findings, lessons learned, and corrective actions to technical and management audiences.

• Engage with external partners, suppliers, and industry groups to benchmark best practices and drive continuous improvement.

• Mentor junior engineers and contribute to a culture of technical excellence and innovation.

Qualifications

Required:

• Bachelor’s, Master’s, or Doctorate in Engineering, Materials Science, Physics, Chemistry, or a related field.

• 5+ years of experience in reliability or product engineering, with demonstrated expertise in reliability methods, failure analysis, and product validation.

• Experience with reliability engineering for advanced materials, microfluidics, or semiconductor packaging is highly desirable.

• Strong analytical skills and proficiency in experimental design, data analysis, and technical reporting.

• Excellent communication and teamwork skills.

Preferred:

• Experience with high-reliability, high-complexity R&D environments.

• Familiarity with design of experiments, FMEA, and reliability modeling.

• Proven ability to work in fast-paced, cross-functional teams and manage multiple priorities.

• Experience with supplier engagement and external technical collaborations.

The pay range for this role is$93,400to$143,800USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance

• Dental insurance

• Vision insurance

• Long term/short term disability insurance

• Employee assistance program

• Flexible spending account

• Life insurance

• Generous time off policies, including;

• 4-12 weeks fully paid parental leave based on tenure

• 11 paid holidays

• Additional flexible paid vacation and sick leave ( US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Yes

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal"