
We are seeking an on-site R&D Test Engineer to join our AI Chips team. This role will work closely with the thermal/mechanical/reliability lead to execute thermal testing, coordinate reliability testing, design and develop custom test hardware and fixtures for customer prototyping of single-crystal diamond applications on AI customer chips, and generate engineering insights that guide customer engagements and product development.
The ideal candidate is a hands-on thermal or mechanical engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.
Support customer prototyping projects through design and development of mechanical fixtures and experimental apparatus using CAD software, and coordinate fabrication with internal and external machine shops.
Coordinate accelerated lifetime reliability testing and environmental stress testing per industry standards to validate long-term performance and durability of SCD-on-silicon attachment methods, package integrity.
Design, build, operate, and troubleshoot thermal characterization test platforms to evaluate SCD thermal solutions on thermal test vehicles (TTVs) and customer hardware.
Develop assembly processes for prototype hardware, including thermal interfaces, mounted cooling solutions, and instrumentation integration as needed.
Manage project schedules, technical risks, cross-functional communication, customer updates, and technical reports.
Degree & Experience: BS or MS in Mechanical Engineering or a related discipline, with 2+ years of experience in mechanical/thermal engineering, test engineering, or product development.
Thermal & Reliability Testing: Experience with laboratory instrumentation and data acquisition systems (Preferred: thermal testing/characterization for packaged devices, liquid cooling solutions like fans/cold plates, and reliability/environmental stress testing).
Software & Simulation: Proficiency with CAD software (SolidWorks preferred) (Preferred: familiarity with FEA and CFD tools such as ANSYS Mechanical/Fluent, Icepak, or COMSOL).
Data Analysis & Fabrication: Experience creating engineering drawings to support fabrication, alongside data processing and analysis using MATLAB, Python, Excel, JMP, or similar tools (Preferred: familiarity with IC packaging, metrology, or failure analysis).
Professional Attributes: Strong problem-solving and communication skills, with a hands-on, detail-oriented mindset, comfortable working cross-functionally in a fast-paced R&D environment.

Founded in San Francisco in 2013, we have grown into the #1 producer of single-crystal diamond globally. We are the rare unicorn that has grown fast profitably. Ours is one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.
We are now in the 2nd stage of our 30-year master plan:
2013+: Deliver sustainably created diamond for wherever mined diamond has been able to go. Reform diamond jewelry in the process.
2023+: Put a diamond behind every high-power chip. Solve the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless.
We have managed to create the world's first single-crystal diamond wafers — and created the world’s most compact power electronics with it: 8x smaller than Tesla’s.
2033+: Diamond semiconductors. Transistors with 17,300x the semiconductor merit over silicon.
In 100 years, no-one will remember what Google was but all tech will be based on diamond electronics.
More at www.DF.com
AWARDS
Fast Company World's Most Innovative Company
TIME Best Inventions
Business Insider’s 21 Most Innovative Tech Startups
CNBC’s Top 50 Disruptors
Inc’s 25 Most Disruptive Companies