
We are seeking an on-site R&D Process Engineer to join our AI Chips team. This role will support customer prototyping and internal process development for advanced packaging applications, with a focus on integrating single-crystal diamond with AI customer devices to demonstrate thermal and performance benefits.
The ideal candidate is a hands-on process engineer with strong technical problem-solving skills, a collaborative mindset, and the ability to support fast-paced customer and internal development programs.
Support customer prototyping projects to integrate single-crystal diamond with customer devices and demonstrate thermal and performance benefits.
Develop advanced packaging and bonding processes adaptable to diverse customer device designs, material stacks, package configurations, and integration requirements.
Evaluate, select, and optimize bonding technologies, including pressure/pressureless sintering, thermocompression, surface/plasma-activated bonding, and emerging methods.
Drive internal process development and validation, including cleaning, metallization, DOE-based bonding optimizations, process characterization, failure analysis, and reliability testing.
Manage end-to-end project execution, covering schedules, technical risks, cross-functional communication, customer updates, and technical reports.
Bachelor’s or advanced degree in materials science, electrical engineering, chemical engineering, or a related field.
Experience in semiconductor packaging, advanced materials, process engineering, device integration, or related technical development is preferred.
Familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, or similar process technologies is desirable.
Strong problem-solving skills and willingness to learn new materials, tools, and processes.
Good communication skills and ability to work effectively with cross-functional teams, hands-on, detail-oriented, motivated, and comfortable working in a fast-paced development environment.

Founded in San Francisco in 2013, we have grown into the #1 producer of single-crystal diamond globally. We are the rare unicorn that has grown fast profitably. Ours is one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy.
We are now in the 2nd stage of our 30-year master plan:
2013+: Deliver sustainably created diamond for wherever mined diamond has been able to go. Reform diamond jewelry in the process.
2023+: Put a diamond behind every high-power chip. Solve the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless.
We have managed to create the world's first single-crystal diamond wafers — and created the world’s most compact power electronics with it: 8x smaller than Tesla’s.
2033+: Diamond semiconductors. Transistors with 17,300x the semiconductor merit over silicon.
In 100 years, no-one will remember what Google was but all tech will be based on diamond electronics.
More at www.DF.com
AWARDS
Fast Company World's Most Innovative Company
TIME Best Inventions
Business Insider’s 21 Most Innovative Tech Startups
CNBC’s Top 50 Disruptors
Inc’s 25 Most Disruptive Companies