Job Description

Job Title: R&D
Power Module Section Manager

Our client is
seeking an experienced R&D Power Module Section Manager to provide
technical leadership for the development and manufacturing of advanced
semiconductor power-module products. This position will coordinate
cross-functional engineering activities, establish product and process-design
standards, and drive improvements in quality, reliability, cost, and
manufacturing performance.

Key Responsibilities

• Serve as the technical leader
  for power-module development and manufacturing activities.
• Coordinate with Process
  Engineering, Quality Assurance, Equipment Engineering, Product Management,
  Design Engineering, and other relevant teams.
• Establish product-design
  guidelines and design rules for power-module products.
• Define critical process
  parameters, control requirements, material-selection criteria, and
  package-reliability standards.
• Lead process-design,
  process-control, and manufacturing-readiness activities for new and
  existing products.
• Provide technical direction
  and resolve complex product, process, quality, and reliability issues.
• Review engineering data and
  ensure appropriate application of SPC, DOE, APQP, FMEA, and other quality
  methodologies.
• Communicate technical
  requirements, risks, and solutions to internal stakeholders and customers.
• Drive yield improvement,
  defect reduction, process optimization, and operational excellence.
• Lead or support
  cost-reduction projects related to power-module products.
• Coach and develop engineering
  team members while ensuring projects are delivered according to quality,
  cost, and timeline expectations.

Qualifications and
Experience

• Bachelor's degree or higher
  in Electronics, Electrical Engineering, Mechanical Engineering, Materials
  Engineering, Chemical Engineering, Industrial Engineering, or a related
  field.
• At least eight years of
  relevant experience in semiconductor assembly, power modules, wafer-level
  packaging, IC packaging, or electronic-module manufacturing.
• Previous experience in a
  technical leadership, project leadership, supervisory, or
  engineering-management capacity.
• Strong experience in product
  or process development, material selection, assembly, and package
  reliability.
• Strong knowledge of
  engineering data analysis, SPC, DOE, APQP, and FMEA.
• Candidates must have detailed
  practical knowledge of at least two or three of the following processes:
• Advanced SMT, including
  high-density, multilayer, or double-sided component assembly.
• Silver or copper sintering,
  including pressure and pressureless sintering.
• Soft-solder die attach.
• Aluminium or
  aluminium-copper wedge and ribbon bonding.
• Vacuum or formic-acid
  reflow.
• Advanced flip-chip
  processes, including multi-die, stacked-die, fine-pitch flip chip, and
  thermo-compression bonding.
• Capillary underfill for
  fine-pitch flip-chip or thermo-compression bonding applications.
• Advanced copper-clip
  processes, including exposed copper clips.
• Heat-sink or heat-slug
  attachment.
• Advanced moulding, including
  double-sided moulding, low-wire-sweep moulding, liquid moulding, and
  compression moulding.
• Low-stress blade or
  laser-singulation processes.

Key Competencies

• Strong technical leadership
  and cross-functional coordination skills.
• Excellent analytical,
  decision-making, and problem-solving abilities.
• High level of responsibility
  and attention to detail.
• Quality-focused mindset with
  a strong commitment to zero-defect manufacturing.
• Ability to communicate
  effectively with technical teams, management, and customers.
• Good command of English.