Job Description

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.

At Qnity, we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.

Qnity Electronics offers an exciting and challenging opportunity within our Advanced Circuits and Packaging (ACP) business for an experienced Application Engineer located in Dongtan, Korea.

Join our advanced packaging metallization team and drive development, application and engage strategically with key customers for electroplating products in the semiconductor industry.

ACP team closely collaborates with the world leading customers to succeed together in both existing and emerging markets. The position in the metallization group will focus on the new product development for electrodeposition of various metals in the semiconductor industry. Key areas focus include products and materials for lead-free solder (SnAg and Pure Tin), copper application (Cu pillar, RDL, Damascene and TSV) and other metal applications

Key Responsibilities:

• Must have good teamwork / collaboration with other Korea R&D groups, excellent customer communication skill
• Responsible for development and execution of plating and associated processing DOEs in support of new product development. Must ensure high quality data generation, including statistical design
• Candidate will have direct customer engagement experience with metal plating chemistry and plating process technologies (e.g., Plating technologies for solder bumping, RDL, TSV, Damascene, etc..).
• Foster close coordination and cooperation between new product development teams / Technical support teams in Asia Pacific Region and North America Region
• Ensure safety at ACP Metallization R&D Lab, will work on safety-related improvement work for a better workplace.

• Highly recommended to work on intellectual property development.

Qualifications:

• Bachelor with minimum 2 years of relevant field / Master's and higher degree in Chemical Engineering, Chemistry, Materials Science, or a related field
• Knowledge and experience in Advanced packaging technology or electro-plating process, semiconductor packaging is preferred for effective evaluation and new product development collaboration
• Proficiency in DOE and statistical design methodologies
• Korean & English communication skills in verbal and written for technical writing and presenting

#LI-MK1

Join our Talent Community to stay connected with us!

Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit ourAccessibility Page for Contact Information

Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page

We use Artificial Intelligence (AI) to enhance our recruitment process.