The QCT Product & Test group has an opening for a test board design position. This group develops test solutions for high-volume and high volume production testing of Mobile Station Modems (MSM), baseband mixed-signal devices, RF receivers/transmitters/transceivers, audio devices, and power management ASICs designed by QCT. We are seeking a Senior PTE HW Engineer of relevant experience to lead probe card design activities and drive cross‑functional and supplier execution. This role requires strong technical expertise in probe card hardware design as well as solid project coordination skills to manage timelines, supplier deliverables, and resources across multiple programs.

【Responsibilities】

• Lead end‑to‑end probe card design activities, including concept development, schematic/layout review, design validation, and bring‑up support.
• Own technical execution and schedule for probe card projects, from design kickoff through HOD and customer handoff.
• Serve as the primary technical interface to external probe card vendors, driving design reviews, issue resolution, and schedule alignment.
• Coordinate project timelines, resource planning, and priority setting with internal cross‑functional teams (PTE, Ops, ME, sourcing, etc.).
• Actively track project status, identify schedule or technical risks, and drive mitigation plans to minimize impact.
• Review and approve vendor deliverables, including design documents, layouts, and build readiness checkpoints.
• Support root cause analysis (RCA) and corrective / preventive actions for probe card design, fab, or assembly issues.
• Contribute to continuous improvement of probe card design flows, supplier engagement models, and execution processes.

【Minimum Qualifications】

• We are a collaborative PTE HW team with a strong culture of teamwork and sharing. As a team member, you should be eager to learn new knowledge in different fields, collaborate within the team, share knowledge and experience, and seamlessly contribute as a member of the PTE hardware team
• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or a related field.
• 5–10 years hands‑on experience in probe card design, test hardware, or related semiconductor HW development.
• Solid understanding of probe card architectures, PCB design fundamentals, signal integrity / power integrity considerations, and mechanical interfaces.
• Proven experience working closely with external vendors or suppliers on hardware design and delivery.
• Demonstrated ability to manage project schedules, dependencies, and engineering resources across multiple projects.
• Strong communication skills, with the ability to clearly align technical and schedule expectations across internal teams and suppliers.
• Comfortable working in a fast‑paced, multi‑project environment with changing priorities.

【Meeting the following criteria will be a plus】

• Serve as the HW project lead, facilitating relevant project meetings for requirement discussions, design reviews, and progress reviews.
• Ability to organize effectively and document work thoroughly and follow required procedures and methodologies.
• Able to generate breakthrough ideas and gain support to translate new ideas into solutions.

• Experience driving supplier improvement, cost, or lead‑time reduction initiatives.