Job Description

Meta is seeking an Advanced Manufacturing Engineer, Product Quality, to develop and implement world-class manufacturing and quality processes for the next generation of AI/ML & Networking hardware. You will work at the intersection of design and the factory floor, partnering with the ODM manufacturing ecosystem to bring open compute hardware from first build to high-volume production at datacenter scale. Beyond executing on today's products, you will own the SMT and PCBA assembly manufacturing technology roadmap — identifying the process capabilities Meta will need several product generations out, working with ODM partners to build them before they are needed, and partnering with our packaging technology team to ensure new packaging technologies can be manufactured at scale.

This is a full time position and reports to the Manager of Product and Quality Engineering as part of the Hardware Quality Engineering team and is based at our APAC office.

Responsibilities

Own and drive the Advanced manufacturing technology roadmap for SMT and PCBA assembly, translating Meta's multi-generation hardware direction into the process, equipment and materials capabilities required to build it

• Partner with ODMs and EMS providers to develop and qualify new manufacturing capabilities ahead of product need — defining capability gaps, shaping joint development plans and equipment or process investments, and driving them from evaluation through production readiness
• Collaborate with Meta's packaging technology team to ensure the manufacturing and assembly requirements of new advanced packaging technologies are understood and enabled at our manufacturing partners, representing assembly process capability, yield and reliability considerations into packaging technology decisions
• Benchmark supplier and industry process capability, and influence internal design and technology roadmaps with a manufacturability point of view
• Develop and implement manufacturing processes for Meta open hardware technologies, applying knowledge of product design, fabrication, assembly and testing
• Lead SMT (Surface Mount Technology) process development for next-generation package and PCBA technologies in partnership with internal and external teams
• Engage Meta engineering teams early to drive robust DFx requirements and ensure products meet cycle-time, cost, quality and yield targets
• Serve as the technical authority for PCB and PCBA assembly process, materials and reliability within cross-functional project teams
• Lead failure analysis on solder-joint and assembly defects using X-ray, CT, cross-section and dye-and-pry techniques

Qualifications

Bachelor's degree in Mechanical, Materials, Electrical, Chemical, Industrial/Manufacturing Engineering, or equivalent practical experience

• Strong working knowledge of SMT process and PCB manufacturing processes
• Excellent problem solving and communication skills
• 8+ years experience in manufacturing of enterprise Hardware products
• Knowledge of quality methodologies and tools is required
• Some International travel may be required Proven expertise in SMT manufacturing process development leveraging design of experiments (DOE)
• Track record of influencing ODM or supplier capability investment and technology direction
• Experience evaluating emerging assembly and interconnect technologies and bringing them into production
• Solid background in Advanced Packaging and Printed Circuit Board (PCB) manufacturing for enterprise hardware products is highly desirable
• Strong proficiency in DFx software (e.g., Valor NPI, Cadence Allegro) for PCBA design, analysis, and optimization