Job Description

Work Schedule

Standard (Mon-Fri)

Environmental Conditions

Office

As part of the Thermo Fisher Scientific team, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life every single day to enable our customers to make the world healthier, cleaner and safer. We provide our global teams with the resources needed to achieve individual career goals while helping to take science a step beyond by developing solutions for some of the world’s toughest challenges, like protecting the environment, making sure our food is safe or helping find cures for cancer.

Location: Taiwan

Division: [Clinical Sequencing Division]

About the Role

We are seeking a Chip Assembly Product Engineer to support new product introduction (NPI), assembly yield improvement, and production ramp of semiconductor devices used in advanced scientific instrumentation.

This role bridges design, wafer fabrication, OSAT assembly, and test to ensure robust, manufacturable, and high-yielding products from first silicon through volume production.

This is a hands-on engineering role ideal for candidates with 0–4 years of semiconductor assembly, packaging, or product engineering experience.

Key Responsibilities

• Support product bring-up from wafer sort through final assembly and test

• Work with OSAT partners to ensure process capability and yield targets

• Monitor assembly yield, analyze defect paretos, and drive root cause investigations

• Coordinate failure analysis activities (CSAM, X-ray, cross-section, SEM, etc.)

• Support reliability qualification

• Assist in resolving manufacturing excursions and yield loss

• Review and maintain assembly documentation and process flows

• Collaborate with Design, Test Engineering, Quality, and Supply Chain teams

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related field

• 0–4 years of experience in semiconductor assembly, packaging, product engineering, or related manufacturing environment

• Understanding of semiconductor assembly processes (die attach, wirebond, molding, singulation, etc.)

• Experience analyzing yield data and supporting root cause investigations

• Strong analytical and problem-solving skills

• Strong written and verbal English communication skills (required for global collaboration)

Preferred Qualifications

• Experience working with OSAT vendors

• Exposure to failure analysis tools (CSAM, X-ray, cross-sectioning)

• Knowledge of package reliability and defect mechanisms

• Experience supporting NPI or production ramp

What You Will Gain

• Exposure to full product lifecycle from development to high-volume manufacturing

• Direct interaction with global engineering teams

• Hands-on experience in semiconductor assembly and reliability engineering

• Career growth within a global technology organization