Job Description
Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something.
As one of us (SiP process NPI team), you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
As a SiP NPI engineer, you will play a crucial role in developing next generation SiP process for various of end products. You will be deeply involved from early design phase , prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, you will be the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned.You will also be the major contact window to behavior of our team and collaborate with Internal / external X-function teams.
Preferred Qualifications
Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing
Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages
Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP)
Ability to work under pressure with a wide range of people with varying degrees of experience
Familiar with quality tools, including SPC, Cpk, DOE, data distribution, data correlation, commonality study and etc
Excellent communication skills with both Mandarin & English
Minimum Qualifications
M.S degree in mechanical engineering, physics, materials science or equivalent, with a minimum of 3 years of experience in IC packaging (for Bachelor, minimum 5 years experience is required)
General knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials.
