Job Description

Coherent Corp. is the global leader in photonics, designing and manufacturing advanced laser, optical, and material technologies used by customers worldwide across industrial, communications, electronics, and instrumentation markets.

With a broad global footprint and deep engineering capability, we combine advanced manufacturing, applied innovation, and customer collaboration to deliver high-performance solutions that enable critical technologies and solve complex, real-world challenges.

About Coherent in Switzerland

Coherent Corp. Zurich is a key research and production hub specializing in advanced photonics, engineered materials, and high-power semiconductor laser technologies. Our teams develop and manufacture opto-electronic components and laser diodes for industrial, optical data transmission, life science, and high-precision applications, combining strong in-house R&D with state-of-the-art semiconductor manufacturing in an engineering-led culture.

Location Zurich, Switzerland (Onsite) | Employment Type: Permanent, full-time

For our Process Engineering department, we are looking for an Engineer to support and further develop wafer backside processing and plating technologies processes in our GaAs/InP production line. The role includes responsibility for the evaluation of advanced plating/deplating technologies and the introduction of a temporary bonding process equipment platform. In addition, the position supports the development of thin wafer handling technologies, including wafer thinning and sawing.

Key Responsibilities

• Optimize and support the introduction of temporary bonding and debonding processes, including adhesive coating and in line metrology with new equipment in a team of engineers.
• Develop plating and metal structuring processes, including bump plating, electrochemical deposition, and metal removal techniques such as deplating and wet etching.
• Support the evaluation of wafer thinning and planarization manufacturing equipment.
• Maintain and continuously improve assigned wafer processing and singulation processes. Diagnose and resolve issues in the manufacturing process.
• Conduct test series and DOE studies, analyze results and prepare technical reports.
• Support yield improvement activities in wafer thinning, singulation and VCSEL processing.
• Regularly review and update process documentation, specifications and work instructions and train production personnel.
• Interface with external equipment manufacturers and act as the internal technical expert for assigned processes.
• Collaborate closely with engineering, R&D and production teams to introduce new wafer processing technologies.

Qualifications

• B.Sc. or M.Sc. in Chemistry, Physics, Materials Science, Optics, Mechanical Engineering, Electrical Engineering, or a related field, with 3–5 years of relevant industry experience.
• Or a PhD in a relevant field, which may be considered in lieu of professional experience or with reduced experience requirements.

Skills & Other Requirements

• Solid background in semiconductor process engineering or a closely related industry.
• Knowledge of singulation/thinning technologies or temporary wafer bonding/debonding as well as coating is a plus.
• Experience in planning, scheduling and executing engineering projects.
• Competent in design of experiments (DOE) and statistical process control. Certifications such as Six Sigma are advantageous.
• Proficiency in root cause analysis techniques such as 5 Whys, Fishbone Diagrams and FMEA.
• Strong communication skills and ability to work effectively with cross-functional teams including design, quality and production.
• Experience with programming (C#, Python) and statistical tools (JMP, Minitab) is an asset.
• Excellent written and spoken proficiency in German and English.

Application Process

All candidates who wish to apply should submit a CV and cover letter outlining their interest in the position and how their skills and experience align with the requirements of the role.

Applications for this role close end of day on Thursday, 30 April 2026.

If you require any adjustments or accommodations during the application process, please reach out to allegra.mousaw@coherent.com We are committed to creating an inclusive and accessible recruitment experience and encourage applications from individuals of all backgrounds.

Coherent is a global leader in lasers, engineered materials and networking components. We are a vertically integrated manufacturing company that develops innovative products for diversified applications in the industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. Coherent provides a comprehensive career development platform within an environment that challenges employees to perform at their best, while rewarding excellence and hard-work through a competitive compensation program. It's an exciting opportunity to work for a company that offers stability, longevity and growth. Come Join Us!

Note to recruiters and employment agencies: We will not pay for unsolicited resumes from recruiters and employment agencies unless we have a signed agreement and have required assistance, in writing, for a specific opening.