Job Description

IPG Photonics is revolutionizing the laser industry as the pioneering developer and leading producer of fiber lasers and amplifiers. Headquartered in Marlborough, MA, IPG has over 4,800 employees in more than 30 locations around the world. We aspire to work together with our employees and customers to apply light in ways that improve life.

Our mission is to develop innovative laser solutions to make the world a better place. To accomplish this mission, we are committed to attracting and retaining the best talent and an engaged and thriving workforce that drives a sustainable future for our company and society.

Working at IPG Photonics you can expect challenging projects, a motivating and friendly environment, and competitive benefits.

We are seeking a highly motivated and skilled Process Development Engineer to lead the development, optimization, and qualification of advanced soldering processes for high-power and high-current optoelectronic components. This role is critical to enhancing the reliability, thermal performance, and manufacturability of next-generation optoelectronic devices used in demanding applications.

Key Responsibilities:

• Process Development & Optimization:
• Design and implement improved soldering processes tailored for high-power optoelectronic components.
• Evaluate and select solder materials and surface finishes to meet thermal, electrical, and mechanical requirements.
• Develop robust process parameters for reflow, laser soldering, or other advanced joining techniques.
• Qualification & Reliability Testing:
• Define and execute qualification plans, including thermal cycling, power aging, and mechanical stress testing.
• Analyze failure modes and drive corrective actions to improve process robustness and yield.
• Cross-Functional Collaboration:
• Work closely with design, materials, and manufacturing engineering teams to ensure process compatibility with product requirements.
• Support transition of developed processes to volume production, including documentation, training, and troubleshooting.
• Data Analysis & Reporting:
• Use statistical tools (e.g., DOE, SPC) to analyze process data and drive continuous improvement.
• Prepare technical reports and present findings to internal stakeholders and external partners.

Qualifications

Qualifications:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.
• 5+ years of experience in soldering process development, preferably in optoelectronics, power electronics, or semiconductor packaging.
• Strong understanding of thermal management, metallurgy, and interconnect reliability.
• Expertise in intermetallic compound (IMC) formation and control at solder-substrate interfaces to ensure long-term reliability.
• Proficiency in advanced failure analysis methods, including SEM, EDS, X-ray, and cross-sectional analysis to investigate solder joint integrity and degradation mechanisms.
• Familiarity with solder joint reliability standards such as IPC-9701, JEDEC JESD22-A104, and MIL-STD protocols.
• Excellent problem-solving, communication, and project management skills.

Preferred Skills:

• Experience with high-current or high-power device packaging.
• Experience with high-power semiconductor lasers manufacturing and/or testing
• Background in optoelectronic component design or integration.

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