Job Description

We are seeking to appoint an experienced Process Engineer (Packaging & Assembly) to establish, develop, and lead a robust end-to-end packaging system capability.

This role is both strategic and hands-on It requires deep technical expertise in semiconductor packaging and module assembly, combined with the ability to architect scalable manufacturing systems that transition seamlessly from technology development through NPI to high reliability volume production.

We're looking for someone who will:-

• Own packaging process architecture across the full product lifecycle.
• Advise leadership on packaging technology direction and capital strategy.
• Lead hands-on process optimisation and problem-solving activities on the production floor.
• Build scalable systems capable of supporting defence and telecom growth programmes.

Key attributes:

• Technically authoritative and systems oriented.
• Equally comfortable defining strategy and working hands-on with equipment.
• Data-driven, analytical, and detail-focused.
• Strong communicator able to influence cross-functional stakeholders.
• Thrives in a fast-paced, high-technology manufacturing environment.

Key Responsibilities:

• Packaging System Architecture & Strategy

• Define and implement a structured, end-to-end packaging and assembly system aligned with our RF product roadmap.
• Establish standardised process flows covering

- Die preparation

- Die attach

- Wire bonding

- Plastic encapsulation / moulding

- Dicing / singulation

- QFN assembly

- Inspection, reliability and SMT integration

• Technology & Concept Phase (Pre-NPI Influence).
• NPI & Process Architecture Development
• Lifecycle Ownership - Concept to Volume
• Hands-on Technical Leadership
• RF & High-Frequency Packaging Integration
• Equipment, Capital & Supplier Strategy
• Governance, Compliance & Reliability

Requirements

University Degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related discipline, or relevant experience in semiconductor packaging and assembly processes including:-

• QFN
• Plastic encapsulation and moulding
• Dicing and singulation
• Die attach and wire bonding
• Proven experience taking processes from R&D through to volume production.
• Strong expertise in structured problem-solving (DMAIC, 8D).
• Experience with SPC, Cp/Cpk, and Design of Experiments (DoE).
• Detailed knowledge of industry standards including MIL-STD-883 and IPC 600/610/7711.
• Proven track record in taking processes from R&D through to volume production.

Desirable:

• Experience in high-tech, semiconductor, or manufacturing industries.
• Experience in RF or high-frequency electronic manufacturing.
• Experience with equipment specification, procurement, and commissioning.
• Knowledge of RF packaging requirements and JEDEC standards.
• Experience with thermomechanical modelling and material reliability testing.
• Lean Six Sigma Green Belt certification or similar.
• Experience within electronics manufacturing environment, preferably as a Process Engineer within RF electronic production/CEM manufacturing organisation.

A FULL JOB DESCRIPTION IS AVAILABLE ON REQUEST AS THE ABOVE IS ONLY A SNAP-SHOP OF WHAT THE ROLE ENTAILS.

Benefits

Please call our Talent Partner, Bruce Mair on 07483 917543 (anytime) if you would like to chat about this role or clarify the salary and benefits prior to investing your time applying.

Filtronic plc is an equal opportunities employer and is committed to building a diverse and inclusive workplace where everyone can thrive. We welcome applications from all qualified candidates regardless of age, gender, ethnicity, religion, sexual orientation, or disability status. If you require any adjustments or accommodations to support you during the interview process, please let us know and we will be happy to assist.