Job Description

The Dry Etch Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.

• Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments and adjust or optimize processes for Fab Operation.
• Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality.
• Guide and assist Process Technicians through challenging process steps.
• Analyze metrology results and disposition lots based on data and pass/fail criteria.
• Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team.
• Provide effective pass-downs to support uninterrupted operation for Dry Etch activities.
• Sustain and improve processes for wafer fabrication.
• Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality, and product yields.
• Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment.
• Assure that the manufactured products conform to specifications and application requirements.
• Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations
• Sustain existing processes in the areas of, Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM) and Barrel etching, etch process recipe creations, inspections, defects control, and standard Dry Etch related metrology such as ellipsometry or profilometry.
• Create and maintain operating specifications for production processes and equipment.
• Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.

Requirements

• Processing experience in a fab in the area of Dry Etch processing using Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave Ashing
• Experience with Statistical Process Control (SPC)
• Basic understanding of algebraic concepts
• Data extraction, analysis, and reporting experience
• Basic understanding of Semiconductor processing
• Ability to troubleshoot basic problems and address root causes
• Ability to understand all maintenance activity details required to ensure a healthy and repeatable process
• Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines
• Ability to operate processing tools, write and run Dry Etch recipes, inspect wafers under the microscope, and perform basic characterization related to Dry Etch processing with particles / defects metrology, and thickness / uniformity metrology
• Must be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays).
• BS in Electrical Engineering, Material Science, Physics, Chemistry, or related + 9 years, MS + 7 years, or Ph.D. + 4 years

Competencies

• Hands-on mindset
• Excellent Communication skills
• Collaboration
• Quick Learner
• Strong interpersonal skills
• Self-starter
• Prioritization
• Accountability
• Innovative

Work Environment

80%+ of work is performed in the Fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.

Physical Demands

• Frequently in a stationary position, often sitting and/or standing for prolonged periods (3 hours)
• Frequently viewing a computer monitor for prolonged periods (3 hours)
• Frequently walking around the Fab for prolonged periods (3 hours)
• Occasionally required to push and/or pull 50+ lbs objects, such as tool components
• Occasionally required to lift 50+ lbs and occasionally carry that amount short distances (# ft)
• Occasionally required reach, bend, twist, squat, kneel, and stoop to access and work on tools in the Fab
  • May often require repetitive motions involving the wrists, hands, and/or fingers
  • May require different positions and motions in tight and confined spaces
• Occasionally required to handle items using small ranges of motion (e.g. fingers and hands) and large ranges of motion (e.g., full-arms and shoulders) for carrying cassettes and lot boxes
• Constantly required to wear PPE

Work Authorization/Security Clearance Requirements

Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.

Affirmative Action/EEO Statement

The employment policy of Skorpios is to provide equal opportunity to all individuals. Employment decisions are based on merit and business needs. It is the policy of this Company not to discriminate against any employee, or applicant for employment, because of age, sex (including pregnancy, perceived pregnancy, childbirth, breastfeeding, or related medical conditions), color, race, creed, national origin, religious persuasion (including religious dress and grooming practices), marital status, sexual orientation, gender identity, political belief, genetics, disability that does not prohibit performance of essential job functions with or without reasonable accommodations, medical condition, or any other protected characteristic under applicable federal, state, or local laws. Skorpios also does not discriminate on the basis of national origin or citizenship status, as provided under the Immigration Reform and Control Act of 1986.

Other Duties

Please note this job description is not designed to cover or contain a comprehensive listing of activities, duties, or responsibilities that are required of the job. Duties, responsibilities, and activities may change at any time with or without notice at the discretion of the company.

****Recruiters or Agencies will not be considered for this position***