TheProcessDevelopmentEngineeris responsiblefordeveloping new and/orexpandingcurrent assembly process platformsand transferring themto manufacturing He orshe must be a multitaskingteam player and able tointerface with multiple engineeringgroups.The person should have hands-on experience withprocessdevelopment and be well versed in mechanical engineering ormaterials scienceas well as with automated equipment ina high-volumemanufacturingenvironmentHe orshe should be adept in automated equipment,such as but not limited to,optical devicealignment, pick and place, fiberattach,flip chip assembly, thermocompression bonding, flex circuit interconnect technologies such as u-flex, orpick and place machines withadhesive dispensing capability; Design ofExperiments (DOE), FailureModeEffects Analysis (FMEA), innovative data reduction, and statistical analysis.Experience working in a clean roomenvironment is a plus.Candidate mustbe able toprecisely document and communicate assembly process detailsfor successful transferof assignedprocesses to manufacturing.
Develop, characterize, and qualify manufacturing processes from concept through development andtransfertomanufacturing, including specifyingand procuring required equipment, process flow, process development/verification, and qualification plan
Design, execute,and analyze experiments through DOE and statistical techniques using statistical tools
BSdegree in Engineering with 3 to 6 years of experience orMS
degreeinEngineering, 0 to 4yearsof experience
Demonstrated ability to independently initiate, prioritize, and drive projects to completion
Ability to effectively communicateideas, concepts, andresultsto
both highly technical andnon-technical co-workers within cross-functional teams
Ability to function independentlyas well as in a team environment
Hands-on experience with optoelectronic module assembly processes including optical device alignment, free space optics, fiberattach of fiber pig-tails, flex circuit interconnect,vacuumsolderchambers, hot bar solderequipment, flip chip processing,pick and place, adhesive dispense and thermal cycling
Proven experience in design andprocess development functions
Highly motivated, teamplayeradept at workingand meeting goals cross-functionally
Experience in highvolumemanufacturing a plus
Excellent written andverbal communication skills combinedwitha highattention to detail
Ability to useCAD toolssuch as Creo andorSolidWorks
Working knowledge of mechanical drawings and dimensional tolerances
Understanding of optics is a plus
Ability to maintain aclean andsafe working environment

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile, and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.
Advanced connectivity is key to enable the opportunities of AI – opening new doors for us and our customers. Once known for connecting people, our technology is now essential to connecting intelligence.
Our priority is to deliver superior performance with the trust and security our customers need and we’re a committed innovation partner, shaping the future of connectivity.
For our latest updates, please visit us online www.nokia.com
To view open positions and to apply, please visit: www.nokia.com/careers