Job Description

Process Development & Integration

• Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‑volume manufacturing
• Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
• Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
• Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules

Manufacturing Data & Yield Excellence

• Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
• Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
• Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
• Define and utilize metrology strategies to ensure robust process control

Fab Execution & Cross‑Functional Collaboration

• Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
• Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
• Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp

Technical Leadership & Impact

• Provide technical leadership within the PIC process development domain
• Contribute to continuous improvement of tools, methods, and best practices
• Mentor junior engineers and support knowledge transfer across the broader team

• Ph.D. in Electrical Engineering, Physics, or a related field
• Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications
• Deep expertise in:
  • PIC device physics
  • Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation
  • Opto‑electronic testing of PIC devices
  • Modeling, simulation, scripting, and working with large, complex data sets
  • Physics‑based and data‑driven root cause analysis
• Demonstrated ability to drive cross‑functional engineering teams to measurable outcomes
• Excellent communication and organizational skills

Preferred Qualifications

• Experience supporting technology transfer to high‑volume manufacturing
• Familiarity with yield ramp, qualification, and reliability testing for photonic devices
• Strong communication skills with the ability to translate complex technical issues across disciplines
• Experience working in foundry or captive fab environments supporting compound semiconductor technologies