Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
General Summary:
We are seeking a highly experiencedPCB Engineer to drive next-generationDatacenter and High-performance computing (HPC) platforms
This role will focus onadvanced PCB technologies, manufacturability optimization, and supplier engagement , supporting bothNPI and volume production while shaping Qualcomm’s future hardware roadmap.
Key Responsibilities
1. PCB Design & Manufacturing Readiness
Hands on experience with PCB process including definingand drivePCB design guidelines / stack-up / routing strategy for high-speed, high-layer count datacenterPCBboards
Develop and maintainDFM (Design for Manufacturability) libraries to ensure design compliance with supplier capability
Collaborate with cross-functional teams (SI/PI, mechanical, thermal, system architecture) to optimize board performance and manufacturability
2. Supplier Engagement & Capability Validation
Engage withPCB manufacturers (fabricators & assemblers) to:
Understanddesign rule capability (trace/space, via structures, stack-up complexity, materials)
EvaluateBOM capability including advanced laminates, low-loss materials, and new technologies
Collect and analyze supplier data tovalidate manufacturing capability vs design requirements
Drivemulti-source strategy and supplier qualification for high-volume production
3. NPI & Manufacturing Support
Supportcritical NPI builds for datacenter platforms (AI/ComputePCBboards, high-power systems)
TroubleshootPCB fabrication / assembly issues
Yield excursions
Reliability failures
Process limitations
Lead root cause analysis and implementcorrective & preventive actions (CAPA)
4. Technology Roadmap Development
DrivePCB technology roadmap in collaboration with suppliers:
Advanced via structures (HDI, mSAP, via-in-pad, stacked vias, etc.)
New materials (low-loss, high-Tg, ultra-thin core, glass core evolution)
High layer count / ultra-high density interconnect solutions
Pioneer and implementnew structures, technologies, and BOM solutions to advance Qualcomm’s platform capability
5. Industry & Competitive Intelligence
Monitorindustry trends (Datacenter, AI infrastructure, high-speed PCB technology)
Performcompetitive benchmarking (Hyperscalers, ODM ecosystem, etc.)
Identify emerging strategies to ensure Qualcomm remains aligned withleading-edge technology directions
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
Strong understanding of:
Experience withAI accelerators / server motherboards / high-power boards (100kW+ rack architecture familiarity preferred)
Familiarity withadvanced packaging interaction (SiP, substrate, bridge-based systems)
Experience drivingtechnology co-development with suppliers
Ability to influence cross-functional and executive stakeholders
Key Competencies
Strong analytical and problem-solving skills
Data-driven decision making
Ability to communicate clearly withsuppliers, internal teams, and executive leadership
Experience managing ambiguity in fast-paced NPI environments
Impact
In this role, you will directly influence:
Qualcomm’sdatacenter and AI hardware competitiveness
Supplier ecosystem maturity and scalability
Adoption ofnext-generation PCB technologies and materials
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range and Other Compensation & Benefits
$201,600.00 - $302,400.00
The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link
If you would like more information about this role, please contact Qualcomm Careers
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