Job Description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

QORVO is looking for an IC Substrate Development Engineer with demonstrated experience in high density interconnect substrate development for semiconductor product applications. Experience in mSAP laminate fabrication for RF applications is a must. This position will be located full time in Korea and reporting into QORVO’s RF Packaging Center of Excellence located in Greensboro, NC. Qorvo is looking for future leaders.

The technology needed in the quickly changing RF cellular market requires that packaging innovation provides the business a strategic advantage. The ideal candidate will utilize their broad substrate/PCB development experience to work with our suppliers in developing new substrate technologies for next generation product / technology requirements from concept to high volume manufacturing.

Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the business unit design teams is necessary.

Responsibilities include:

• Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products.
• Develop, qualify, and support clean launch of new laminate material sets and suppliers in line with centralized Qorvo processes and documentation standards.
• Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction.
• Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.
• Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
• Travel to laminate suppliers to provide technical support for technology development, supplier qualification and problem resolution.

Required Skills:

• Learn fast in a high paced environment
• Strong communication skills
• Industry knowledge and experience with laminate/PCB manufacturing including processes such as mSAP Cu pattern plating, panel plating, surface finishes, etc.
• Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus.
• Recognized understanding of IPC laminate/PCB standards
• Strong background in laminate/PCB design rules, manufacturing and qualification standards.
• Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
• Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high volume-manufacturing environment.
• Effective project management skills
• Knowledgeable and up to date network within subcontractors to support advanced packaging technology.
• Proven record of accomplishment in supporting New Product / Processes and/or Technology through innovative packaging solutions
• Fluent in Korean and English

Required Experience:

• 10+ years’ direct experience in PCB/mSAP laminate manufacturing
• Bachelors or higher degree in Chemistry or Engineering disciplines

• #LI-LL1

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.