Job Description

We are seeking a highly motivated and technically accomplished Principal Electrical Engineer to lead technology development initiatives for next-generation electro-optical products. This role is responsible for driving the evaluation, development, and productization of emerging technologies while providing technical leadership throughout the complete product lifecycle, from concept and feasibility through new product introduction (NPI) and high-volume manufacturing.

The successful candidate will possess deep expertise in high-speed electrical design, signal integrity (SI), power integrity (PI), advanced packaging technologies, and product development processes. This individual will serve as a key technical leader, collaborating across multidisciplinary teams to enable innovative optical communication solutions and mentor the next generation of engineering talent.

• Drive technology development for electro-optical modules, ensuring industry leadership and innovation.
• Provide expertise and guidance in SI & PI to enhance product performance and reliability.
• Apply knowledge of advanced substrates (organic build-up, mSAP, HDI PCB) to optimize module designs and high frequency interconnect.
• Understand and optimize manufacturing processes for SMT and micro-electronics.
• Oversee mechanical analysis (FEA, thermal analysis) to ensure robust and efficient designs.
• Lead technology evolution programs, evaluating the readiness of new technologies for productization.
• Execute technology assessments, deep-diving into new technologies to identify opportunities and challenges.
• Provide mentorship to the cross functional engineering team, fostering a culture of knowledge sharing and continuous improvement.
• Collaborate with cross-functional teams to ensure seamless integration of electrical engineering solutions.
• Bachelor's or Master's degree in Electrical Engineering or a related field.
• Minimum 10 years of experience in electrical engineering, with a focus on signal integrity and power integrity.
• Proven expertise in advanced substrate technologies (organic build-up, mSAP, HDI PCB) is essential.
• Strong understanding of manufacturing processes for SMT and micro-electronics.
• Understanding of mechanical analysis tools (FEA, thermal analysis) is highly desirable.
• Ability to lead and mentor a team, fostering a collaborative and innovative work environment.
• Excellent communication and interpersonal skills for effective collaboration with cross-functional teams.
• Analytical mindset with a problem-solving approach to complex engineering challenges.
• Willingness to stay updated with industry trends and emerging technologies.
• Ability to work independently and manage multiple projects simultaneously.