Job Description

• New package technology and platform module development (Si-gel filled module).
• Technical leadership on new power module technology and enabling technology for automotive/industrial application.
• Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team.
• Package/design review for new package development, on-tme release with the first pass success (qualification).
• Present technical finding, design review and recommendation to stakeholders and management.
• Lead package related failure analysis, reliability testing and debug package issues.
• Participate in customer meeting, provide technical clarification and support failure investigation.

• Define power module package strategy aligned with product roadmap.
• Own end-to-end package development from concept to qualification upon company's package development procedures.
• Ensure package reliability, performance, and manufacturability.
• Establish and optimize packaging processes and specifications.
• Collaborate with cross-functional teams (design, wafer fab, test, product engineering).
• Evaluate and introduce new packaging technologies and materials.
• Manage risk, cost, and schedule for packaging programs.
• Support customer engagement for technical discussions and issue resolution.
• Serve as subject matter expert (SME) for packaging within the organization.

• Minium Bachelor's degree of material science or mechanical engineering.
• More than 8 years of power module package development experience including transfer to the production.
• Preferred Si gel filled module package development experience with SiC device.
• Good statistical analysis skills with Minitab or JMP.
• Preferred the knowledge to use Auto CAD software
• Good communication skills with English.