Location:​Alhambra, CA​ (Onsite)

The Photo Engineer – Lithography & Mask Layout position is a technical ownership role within an Indium Phosphide (InP) wafer fabrication facility supporting the manufacturing of DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip (GC) products. This roleis responsible forend-to-end photolithography process development and manufacturing support, including full ownership of mask and reticle layout strategy, stepper and coat/develop track processes, and critical dimension (CD) and overlay controlThe position serves as the primary lithography technical authority forInPdevice manufacturing, ensuring robust, repeatable, and high-yield lithography processes from tape-out throughproduction. The role requires hands-onexpertisein photolithography equipment, layout data preparation, process control, and yield improvement in a compound semiconductor waferfabenvironment.

Responsibilities

Photolithography Process Ownership and Manufacturing Support:

• Own end-to-end photolithography processes forInP-based wafer fabrication, including DFB lasers, SOAs, and gain chip products

• Develop, qualify, andmaintainphotoresist, exposure, develop, and post-lithography processes for front-end and back-end layers

• Provide day-to-day manufacturing support, troubleshooting lithography-related issues and responding to process excursions

• Support new product introduction (NPI), process transfers, and technology changes within theInPwaferfab

Mask and Reticle Layout Ownership

• Lead mask and reticle layout design for all lithography layers, including:

• Layer definition, toneselection, and biasing strategy

• Alignment mark strategy and overlay scheme definition

• Reticle floor planning and field layout considerations

• Serve as the primary technical owner for mask/reticle tape-out, review, release, and revision control

• Coordinate directly with design teams and mask vendors on layout rules, data preparation (GDS, layer mapping), and mask re-manufacture activities

• Ensure layout-for-manufacturability and lithography robustness across all device layers

Lithography Equipment and Process Control Ownership:

• Own stepper and coat/develop track tools, including process qualification, recipe management, and performance monitoring

• Define andmaintainprocess control monitors (PCM/TCM) to ensure lithography process stability

• Drive CD and overlay performance through SPC, process window characterization, and data-driven root-cause analysis

• Partner with metrology and yield teams to improve lithography capability and reduce variability

Yield Improvement and Defect Reduction

• Lead lithography-related yield improvement initiatives and defect reduction efforts

• Analyze lithography-related yield loss mechanisms and implement corrective actions

• Support cross-functional yield reviews and excursion investigations

Documentation, Compliance, and Cross-Functional Collaboration

• Develop andmaintainlithography process documentation, SOPs, travelers, and control plans

• Ensure compliance with internal manufacturing standards and quality systems

• Work cross-functionally with design, process, equipment, and manufacturing teams to support production goals

Minimum Qualifications:

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related fieldrequired

• Minimum of5+ years of experience in semiconductor photolithography, with direct involvement in mask or reticle layout design

• Hands-on experience with lithography steppers/aligners and coat/develop track systems in a waferfabenvironment

• Experience preparing, reviewing, and releasing mask layout data (GDS, layer definitions, alignment strategies)

• Strong understanding of photoresist processes, CD control, overlay metrology, and alignment schemes

• Familiarity with SPC and data-driven process control methodologies

• Experience interfacing with mask vendors and managing mask lifecycle activities

• Preferred experience inInPor III-V compound semiconductor wafer fabrication

• Familiarity with DFB lasers, photonic integrated circuits (PICs), or optical device manufacturing preferred

• Experience supporting high-mix, low-volume manufacturing environments preferred

• Knowledge of mask fabrication processes and mask-related yield risks preferred

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essentialjobfunctions and requirements and are subject topossible modificationtoreasonably accommodateindividuals with disabilities.

A reasonable estimate of the pay range for this position is $73,000 - $110,000.  There are several factors taken into consideration indeterminingbase salary, including but not limited to: job-related qualifications, skills,educationand experience, as well as job location and the value of other elements of an employee’s total compensation package.

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