Job Description

Nexthop AI builds next-generation AI networking platforms for hyperscalers. We are seeking an experienced Manufacturing Engineer to lead SMT, large-BGA, PCBA, and NPI manufacturing with our contract manufacturers.

You will be the technical bridge between Hardware Engineering, Quality, Supply Chain, Operations, and CMs. You will drive design-for-manufacturing, process validation, issue resolution, yield improvement, and production scaling from prototype through high-volume manufacturing.

Key Responsibilities:

• Develop, validate, and optimize SMT and large-BGA assembly processes for complex, high-layer-count PCBAs.
• Establish PCBA assembly, inspection, testing, workmanship, and process-control specifications aligned with IPC standards.
• Drive DFM, DFA, DFT, DFS, and assembly-feasibility reviews for schematics, BOMs, layouts, panels, stack-ups, and manufacturing drawings.
• Lead NPI builds, process qualification, troubleshooting, debug, failure analysis, DOE/EFA, xVT, and production ramp activities.
• Partner with CMs to improve yield, quality, cost, and manufacturing readiness; target defect rates of 150 ppm.
• Resolve issues using RCCA, 8D, 5-Why, DOE, and other structured problem-solving methods.
• Manage defects, escapes, process capability, rework, scrap, and corrective/preventive actions.
• Define and standardize SMT and PCBA best practices across SPI, pick-and-place, reflow, AOI, X-ray, ICT, flying probe, press-fit, FATP, box build, and packaging.
• Manage ECOs, MCOs, deviations, PCNs, work instructions, and special-build requirements through PLM systems.
• Assess CM and supplier capability, lead corrective actions, and collaborate with BGA/component vendors on DfX.
• Support BOM risk assessment, component qualification, inventory readiness, and product lifecycle management.
• Travel to CM and supplier sites as needed for builds, audits, qualification, and issue resolution.

Required Qualifications:

• BS or MS in Electrical, Manufacturing, Mechanical Engineering, or a related field.
• 10+ years of hands-on SMT, PCBA, and large-BGA manufacturing experience; 10+ years of NPI experience preferred.
• Strong experience with complex, high-layer-count PCBAs and prototype-to-production ramps.
• Deep knowledge of PCBA materials, solder-joint metallurgy, reflow, inspection, testing, and assembly reliability.
• Proven experience with PCBA debug, failure analysis, root-cause investigation, and corrective action.
• Experience reviewing PCB layouts, stack-ups, panels, BOMs, and manufacturing requirements for DfX.
• Proficiency with PLM change processes, including ECO, MCO, DEV, PCN, and deviations.
• Familiarity with Allegro, Cadence, Valor, schematic/layout, CAD, and related manufacturing tools.
• Strong cross-functional communication, ownership, prioritization, and problem-solving skills.
• Ability to work effectively in ambiguous, fast-paced environments and travel to CM locations.
• Experience working at a high-volume CM for PCBA and box-build products.
• Experience with 30–40+ layer boards, networking hardware, ASIC-related products, or advanced Networking platforms.