职位概述
我们正在寻找一位注重细节、经验丰富的PCB Layout工程师，加入我们的电力电子研发团队。您将专注新型配电产品中各类电力电子产品的PCB（包括控制板、电源板及大功率功率板）物理设计。您是实现产品高性能、高可靠性和可制造性的关键一环，直接影响到产品的电气性能、散热与EMC表现。 主要职责
--PCB物理设计：根据硬件工程师提供的设计规范，独立完成多层板的布局布线工作。负责包括控制板（高速数字/模拟信号）、电源板（中等功率）及功率板（高电压、大电流）在内的所有类型PCB设计。
--协同设计与规则制定：与硬件工程师紧密合作，理解和消化需求，共同制定详细的PCB布局布线约束规则。针对安规、信号完整性、电源完整性和热管理要求，提供最优的布局方案和布线策略。
--电力电子专项设计：功率回路设计： 优化高电压、大电流路径的布局，最小化寄生电感和回路面积。
--EMC与安规设计： 在布局中严格保证电气间隙与爬电距离，通过优化地平面、屏蔽和滤波器布局来提升EMC性能。
--热设计： 为功率器件和发热元件设计有效的散热路径，包括热焊盘、过孔阵列及与散热器的接口配合。
--信号完整性： 确保关键敏感信号（如采样、驱动信号）的完整性，避免干扰。
--设计输出与文档：生成所有必要的生产文件（Gerber、钻孔文件、装配图、钢网文件等）。创建并维护元器件封装库，确保其准确性和可制造性。编写Layout设计说明文档。
--设计验证与支持：参与PCB设计评审，支持SI/PI/热仿真工程师完成前期仿真。协助解决试产、量产及测试中遇到的PCB相关技术问题。

We are seeking a detail-oriented and experienced PCB Layout Engineer to join our power electronics R&D team. You will focus on the physical design of PCBs (including control boards, power supply boards, and high-power boards) for various power electronic products in new power distribution systems. You will be a critical link in achieving high performance, reliability, and manufacturability, directly impacting the product's electrical performance, thermal management, and EMC performance.

Key Responsibilities

PCB Physical Design:

• Independently complete the layout and routing of multi-layer boards based on design specifications provided by hardware engineers.

• Responsible for designing all types of PCBs, including control boards (high-speed digital/analog signals), power supply boards (medium power), and high-power boards (high voltage, high current).

Collaborative Design & Rule Definition:

• Work closely with hardware engineers to understand and interpret requirements, and jointly define detailed PCB layout and routing constraint rules.

• Provide optimal placement and routing strategies considering safety, signal integrity, power integrity, and thermal management requirements.

Power Electronics-Specific Design:

• Power Loop Design: Optimize the layout of high-voltage and high-current paths to minimize parasitic inductance and loop area.

• EMC & Safety Design: Strictly ensure creepage and clearance distances in the layout; enhance EMC performance by optimizing ground planes, shielding, and filter placement.

• Thermal Design: Design effective thermal dissipation paths for power devices and heat-generating components, including thermal pads, via arrays, and interface coordination with heat sinks.

• Signal Integrity: Ensure the integrity of critical sensitive signals (e.g., sampling, gate drive signals) and avoid interference.

Design Output & Documentation:

• Generate all necessary production files (Gerber, drill files, assembly drawings, solder paste stencil files, etc.).

• Create and maintain component footprint libraries, ensuring their accuracy and manufacturability.

• Prepare PCB layout design documentation.

Design Verification & Support:

• Participate in PCB design reviews; support SI/PI/thermal simulation engineers in pre-layout and post-layout simulations.

• Assist in resolving PCB-related technical issues encountered during prototyping, mass production, and testing.

任职要求
--教育背景：专科及以上学历，电子工程、通信工程、自动化或相关专业。
工作经验：3年以上高速、高密度或高功率PCB Layout设计经验。有光伏逆变器、储能变流器、UPS、伺服驱动器、大功率电源等电力电子产品设计经验者优先。
--专业技能：
设计工具： 精通 Cadence Allegro 等主流EDA设计工具。
专业知识： 深刻理解PCB制造工艺（层压、孔铜、表面处理等）及SMT装配流程。
电气知识： 熟悉IPC标准，具备基本的电路知识，能够理解原理图。
专项能力： 对高速数字电路、模拟电路、功率电路和RF电路的布局布线有深入理解，能独立解决相关的SI、PI、EMC、热设计问题。
--核心素质：
具备较强的责任心、耐心和严谨细致的工作态度。
优秀的沟通能力和团队协作精神，能够高效地与硬件工程师协同工作。
具备优秀的问题分析能力和解决能力，能够承受压力。
--优先考虑条件
熟悉电力电子产品常见的安规标准（如UL 60950-1, UL 1741）及其对PCB布局的要求。
具备完整完成PCB设计项目经历者优先。”

Qualifications & Requirements

Education:

• Associate degree or higher in Electronic Engineering, Communication Engineering, Automation, or a related field.

Experience:

• 3+ years of experience in high-speed, high-density, or high-power PCB layout design. Experience with power electronics products such as PV inverters, energy storage converters, UPS, servo drives, and high-power supplies is preferred.

Technical Skills:

• Design Tools: Proficiency in mainstream EDA design tools such as Cadence Allegro.

• Professional Knowledge: Deep understanding of PCB manufacturing processes (lamination, hole plating, surface finishes, etc.) and SMT assembly processes.

• Electrical Knowledge: Familiarity with IPC standards; solid fundamental circuit knowledge and the ability to understand schematics.

• Specialized Skills: In-depth understanding of layout and routing for high-speed digital, analog, power, and RF circuits; ability to independently solve related SI, PI, EMC, and thermal design issues.

Personal Attributes:

• Strong sense of responsibility, patience, and a meticulous, rigorous work attitude.

• Excellent communication skills and teamwork spirit, enabling effective collaboration with hardware engineers.

• Strong problem-analysis and problem-solving abilities, with the capacity to work under pressure.

Preferred Qualifications

• Familiarity with common safety standards for power electronics products (e.g., UL 60950-1, UL 1741) and their requirements for PCB layout.

• Priority given to candidates with experience seeing PCB design projects through their complete lifecycle.