Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.
MS or Ph.D. and 8+ years of relevant industry experience.
Proven fundamentals in material/chemistry/mechanical engineering field(s).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
Familiarity with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.
BS and 10+ years of relevant industry experience.
We’re a diverse collective of thinkers and doers, continually reimagining what’s possible to help us all do what we love in new ways. And the same innovation that goes into our products also applies to our practices — strengthening our commitment to leave the world better than we found it. This is where your work can make a difference in people’s lives. Including your own.
Apple is an equal opportunity employer that is committed to inclusion and diversity. Visit apple.com/careers to learn more.
