Job Description

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$147,000.00 - $202,500.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits

Product Line Management IV (E4)

The Applied Global Services (AGS) Packaging Service Business Unit (SBU) is seeking an ambitious candidate that possesses strong technical knowledge with Wafer level packaging semiconductor equipment in the areas of hardware design, process engineering and optimization, customer fab operations, as well as business acumen. This person will work closely with BU product development and field support, AGS operations, and AGS field service to ensure products have the documentation, spare part sourcing strategies, and maintenance capabilities required to be successful at customer sites. They will engage in early phases of the new product design cycle to ensure after-sale support planning is included from initial concept through final product release. An ideal candidate should have a strong technical knowledge of packaging equipment, demonstrated technical program management skills and possess strong communication skills. This is a strategic role and will suit someone who can drive growth partnering across the organization to identify and solve customer high vale problems.

Key Responsibilities:

Program Manage service product development from Initiation to Release

• Lead HVP (High Value Problem) discovery through VOC (Voice of Customer) & FSO.
• Propose and select appropriate solutions based on ROI estimates.
• Lead team to assess Market Opportunity and select beta sites.
• Chair regular Core Team meetings to drive design & development of proposed solutions through internal cross-functional teams (OCE, DT/AIx, FV, BU).
• Be accountable for successful beta demonstration by working with FSO, FSO Focals, AGS Focals responsible for the beta site.
• Drive creation of Marketing Collateral, Technical Procedures, and Field Training for sales and BD, CE’s and PSE’s that will support the service agreements enabled by the Service Product.
• Collaborate with AGS focal team to report on service revenue generated by the new Service Product vs. forecast.
• Prepare and Deliver MPR (Monthly Product Reviews) providing status updates and help needed to AGS executives throughout the Phase Gate release cycle.

Closely work with Equipment BU PDP teams to co-develop and integrate AGS service products.

• Work with Business Unit on their NPIs (New Product Introductions) and Legacy tools to prepare and embed service product offerings.
• Spearhead AIx growth engine to develop new capability and enable service product offers.
• Interfaces with BU, FSO / PSE, and customer teams regarding technical requirements, analysis, schedule, deliverables, and closure.
• Collect validation data from demo sites, prepare summary reports and present these reports to SBU management.

Service Readiness

• Accountable for driving the service readiness throughout the Product Life Cycle of Wafer Fab Equipment
• Support Internal and External documentations review for legacy and new products.
• Coordinate and implement Service Product Roadmap releases through program management process (Training, documentation, spares readiness, part repair, etc.).
• Drive/ influence tool design and tooling to protect company values and services.
• Participate in Design for Install & Design for Service programs.
• Works closely with business unit to introduce equipment special tooling.

Functional Knowledge

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field.
• 3-5 years of Wafer Level Packaging / Application / Platform experience.
• Program Management proficiency.
• Skilled at Microsoft Office suite; esp. PowerPoint, Excel.
• Create material and present it executives / large groups.

Business Expertise

• Interprets internal/external business challenges and recommends best practices to improve products, processes, or services.
• Has Semi-space awareness; Regions, customer, segments.

Leadership

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity.

Problem Solving

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgement and identify innovative solutions.
• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions.
• Self-driving; able to negotiate progress around roadblocks; willing to ask for help and find support for developing solutions.

Impact

• Impacts the achievements of customer, operational, project or service objectives; work is guided by functional policies.

Interpersonal Skills

• Communicates difficult concepts and negotiates with others to adopt a different point of view.
• Able to lead and work within matrixed teams.
• Able to influence others and drive teams toward the right path / solution.
• Can present to small and large teams effectively.

Qualifications

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions.
• Minimum of a Bachelor's Degree required, preferably in Chemical, Mechanical, Electrical, Material Science, and/or Data Science.
• Years of Experience: 7 - 10 Years
• Semiconductor industry experience (5+) years, preferably in Wafer Level Packaging related roles

Travel: 10-25%

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 20% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.