Job Description
WHO WE ARE
At NovaSensor, an Amphenol company, we are pioneers in high accuracy sensing solutions. As a global leader in MEMS (Microelectromechanical Systems) technology, we design and manufacture advanced pressure sensors that power critical applications across the medical, automotive, industrial, and consumer markets—whether it's enabling life-saving medical devices, enhancing vehicle safety and efficiency, or ensuring reliability in industrial systems.
We are part of Amphenol, a global leader in advanced interconnect systems, serving diverse markets including automotive, aerospace, industrial, and mobile devices. Amphenol Corporation, a member of the Fortune 500 (NYSE: APH), was established in 1932 and has pioneered innovation in electronics for nearly a century across virtually every end market.
ABOUT THE ROLE
As a Packaging Process Engineer, you’ll design, validate, and refine advanced manufacturing techniques. You'll team up with others to develop state-of-the-art tooling and automation solutions that scale with next-generation product lines and delight our customers.
WHAT YOU WILL DO
- Lead the development and continuous improvement of MEMS pressure sensor assembly processes to enhance performance, quality, and manufacturability.
- Design, develop, and validate MEMS assembly processes for both production and prototype builds, including techniques such as wire bonding, die attach, overmolding, and encapsulation, with optimal materials selection.
- Drive product yield improvements and production efficiency through the application of Lean Manufacturing and Six Sigma principles.
- Design, develop, and implement advanced tooling, fixtures, and equipment solutions to support scalable and reliable manufacturing.
- Collaborate within a cross-functional Engineering team to conceptualize and implement flexible assembly and test platforms for future product lines.
- Conduct hands-on work in a Class 1000 cleanroom environment (approximately 10% of total work time)
- Support global operations with occasional domestic and international travel as required.
WHAT YOU BRING ALONG
- A Bachelor’s degree in Manufacturing Engineering, Mechanical or Electrical Engineering or a related discipline
- Minimum three years of hands-on engineering experience in a high-volume manufacturing environment, ideally within the semiconductor, MEMS or sensor industry.
- Proven expertise in IC or MEMS packaging processes, including wire bonding, die attach, encapsulation, materials selection, and operation of micro-packaging equipment.
- Strong working knowledge of core quality and process tools such as Design of Experiments (DOE), Failure Mode & Effects Analysis (FMEA), Control Plans, and Statistical Process Control (SPC).
- Demonstrated success in developing or supporting products in regulated sectors such as automotive or medical devices.
- Ability to perform effectively in a cleanroom environment while adhering to all required gowning and safety protocols.
- Proficiency in Microsoft Office applications, including Excel, Word, PowerPoint, Project, and Access.
- Apply expertise in workstation layout, design optimization, and ergonomic principles to enhance manufacturing efficiency and operator performance.
- Demonstrate strong written and verbal communication skills, with the ability to produce clear technical documentation and collaborate effectively with internal teams and customers.
- Exhibit a proactive, self-motivated approach with a proven ability to work across multiple projects, meet deadlines, and contribute effectively within cross-functional teams.
WHERE YOU WILL WORK
What we offer
- Competitive salary
- 401(k)
- Health insurance and wellness programs
- 401(k) with company match
- Professional onboarding and training opportunities
- Paid time off
- Health savings account
- Flexible spending account
- Life insurance
- Inclusive and collaborative work environment
