Job Description

Intel is one of the world's most iconic and innovative technology companies, dedicated to designing and manufacturing the foundational semiconductor technologies that power the modern world. From the devices in your pocket to the data centers running the internet, Intel's innovations are everywhere. With a bold vision for the future of computing — spanning artificial intelligence, advanced packaging, and next-generation chip architectures — Intel is transforming what's possible. Our Arizona campuses are among the most advanced semiconductor research, development, and manufacturing facilities on the planet, and they're growing. Join us and be part of something truly world-changing.

Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, Arizona.

In this role, you'll be at the cutting edge of semiconductor packaging innovation — designing, optimizing, and qualifying the assembly processes and equipment that make Intel's most advanced products possible. You'll work on technologies that power mobile devices, edge computing platforms, and high-performance computing systems used by millions of people around the world. This is your opportunity to make a real, lasting impact on the future of technology.

Key Responsibilities

• Develop, optimize, and qualify packaging assembly processes and equipment to meet world-class quality, reliability, yield, and cost targets.
• Lead experimental design and process characterization using Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies.
• Innovate new techniques, materials, and tools to address emerging challenges in packaging quality and reliability.
• Collaborate with cross-functional teams to identify and mitigate technical risks, ensuring success across product development milestones.
• Establish and maintain specifications for materials and equipment, partnering with suppliers to meet performance and quality standards.
• Provide technical consultation and support for packaging challenges in both development and high-volume manufacturing environments.
• Document technical findings, process improvements, and experimental results in reports, white papers, and qualification documents.
• Drive standardization in manufacturing systems, equipment setups, and process flows across Intel sites globally.

As a successful candidate, you must possess

• Collaborative Spirit — You thrive in team environments and build strong relationships across disciplines and organizations.
• Intellectual Curiosity — You love asking "why" and "what if," and you're always looking for better ways to solve problems.
• Results Orientation — You're driven to deliver, even in the face of ambiguity or complexity.
• Clear Communicator — You can translate complex technical findings into clear, actionable insights for diverse audiences.
• Adaptability — You embrace change and can pivot quickly when priorities shift or new challenges emerge.
• Growth Mindset — You're committed to continuous learning and actively seek out opportunities to develop your skills and knowledge.
• Ownership Mentality — You take pride in your work and hold yourself accountable for outcomes.

If you're excited about the opportunity to work on some of the most advanced semiconductor packaging technologies in the world — and to do it alongside a team of world-class engineers in Intel's state-of-the-art Arizona facilities — we want to hear from you.

Qualifications:

This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.

Minimum Qualifications:

• Bachelor’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience; OR
• Master’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience; OR
• PhD in Engineering, Physics, Chemistry, or a related STEM field.
• Relevant industry experience can be any of the following:
• Statistical Process Control (SPC) and Design of Experiments (DOE).
• Hands-on experience with process development, equipment qualification, and characterization in a packaging or manufacturing environment.
• Data analysis and risk assessment capabilities to support informed technical decision-making.

Preferred Qualifications:

• 6+ months of experience:
• Leading technical teams and collaborating across matrixed organizations to drive innovation.
• Advanced semiconductor fabrication processes, assembly methodologies, and packaging flows.
• Knowledge of machine vision systems, automated inspection, and camera-based measurement techniques.
• Programming languages such as Python, MATLAB, or SQL for analyzing complex datasets.

Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.