Job Description

Responsibilities:

We are seeking an experienced Front‑of‑Line (FOL) Lead to own and optimize IC assembly/process steps up to EOL handoff in a high‑volume OSAT environment. The ideal candidate brings deep process expertise across wafer bump/RDL, wafer thinning & dicing, die prep, die attach, wire bond/flip‑chip attach, underfill, molding, singulation, and pre‑test/readiness, driving yield, cost, cycle time, and reliability improvements while ensuring stable HVM at OSATs.

Key Responsibilities:

• Own end‑to‑end FOL process flows for assigned packages (e.g., QFN/QFP, BGA/FCBGA, WLCSP, SIP/POP).
• Define, optimize, and maintain process windows, golden parameters, and control plans for:
• Wafer‑level: RDL, UBM, bumping (Cu pillar/SnAg), wafer thinning, WLCSP passivation, dicing/saw.
• Die prep/attach: die singulation, pick/place, epoxy/DAF attach, eutectic/Ag‑sinter, FC attach.
• Interconnect: wire bond (Au/Cu/Al), stud bumping, flip‑chip reflow; underfill/edge‑bonding.
• Encapsulation & singulation: transfer mold/compression mold, post‑mold cure, saw/laser singulation.
• Own cost of manufacturing (COM) levers: materials usage (epoxy, underfill, mold compound), rework, tool life, consumables, and setup optimization
• Create package build plans, control plans, and risk assessments (PFMEA) for new products/packages.
• Lead engineering builds, pilot runs, correlation plans, and ramp‑to‑HVM with stable yields and CPK.

Essential Attributes

• Proven track record in advanced IC packaging: Wirebond, Flip-Chip, WLCSP, SiP, Fan-Out, or 2.5D/3D.
• Deep hands-on experience with APQP/PPAP, SPC/MSA/DOE, FMEA, 8D, and reliability (JEDEC/AEC).
• Strong understanding of assembly/process flows and failure modes (e.g., delamination, bond lift, die crack, BLR/CLR, substrate warpage).
• Customer-facing quality ownership, including escalation handling and audit leadership.
• Experience with automotive (IATF 16949) or AEC-Q100/104 qualification.

Qualifications

• Bachelor’s/Master’s in Materials, Mechanical, Electronics, Packaging, or Manufacturing Engineering (or related).