Job Description
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.
MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.
Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
Packaging Engineer 1
RFIC package development, supporting NPI from concept through production release. This individual will work with product and design engineers to deliver optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages, metal packages, and pallets for RF and Microwave IC’s. This individual may be required to work on multiple product development programs in parallel to deliver packaging solutions on schedule for high volume manufacturing.
Key Responsibilities
•Provide technical support for RF/microwave plastic, ceramic, and metal packages along with pallets
•Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
•Provide thermal and mechanical modeling for new packages and for improving existing package designs
•Update design rules for packaging as required
•Participate in and contribute to assembly process development internally and at our contract manufacturers
•Participate in troubleshooting IC packaging defects, then define and implement solutions
Key Qualifications and Experience
•BS in Mechanical Engineering, Materials Science, or related field
•Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software
•Experience with AutoCAD is desired
•Ability to work effectively on multiple projects at a time
•Good written and verbal communication skills. Able to present ideas, design concepts, data and plans at team meetings
•Good teamwork skills in working together to achieve goals
•Basic understanding and use of statistical techniques such as DOE and SPC.
•Experience with IC package design and process development, with emphasis on RF and Microwave IC’s, is a plus
•Basic knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.) is a plus
•Understanding of relationship between materials and package performance is a plus
•Experience in failure analysis methodology is a plus
EEO
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
Reasonable Accommodation
MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.
ITAR
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
RSU Eligible
This position is eligible to receive restricted stock
unit (RSU) awards and cash bonuses, solely at MACOM’s discretion, subject to
individual and company performance.
Benefits: This position offers a comprehensive benefits package including but not limited to:
•Health, dental, and vision insurance.
•Employer-sponsored 401(k) plan.
•Paid time off.
•Professional development opportunities.
