• 
  Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression)
• 
  Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time
• 
  Establish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules
• 
  Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance

Requirements

• 
  Bachelor’s degree in Mechanical Engineering,
  Physics, Material Science, or a related field of study
• 
  Minimum 5 years-experience in the semiconductor
  field
• 
  Expert level experience in process development for
  power stage, multi chip module.
• 
  Package layer design expertise such as structural
  configuration, material selection and process flow design
• 
  Hands on skills in operating machines and knowledge
  to down-select material, process optimization and yield improvement
• 
  Expert experience of using ANSYS / FEA for stress
  modeling.

Benefits