Job Description

Packaging Design Engineer (Section Manager / Manager)

Location: Ayutthaya, Thailand

Vacancies: 1

About the Opportunity

Evantis Talent Solutions is recruiting a Packaging Design Engineer at Section Manager / Manager level for a semiconductor manufacturer in Ayutthaya.

The role will lead packaging development activities, support new product introduction and work closely with engineering and manufacturing teams to improve quality, yield and product performance.

Key Responsibilities

• Lead semiconductor packaging development activities from initial development through qualification and manufacturing introduction.
• Coordinate with engineering, assembly and test teams to ensure packaging solutions meet product and manufacturing requirements.
• Lead new product introduction (NPI) and support the qualification of new products and technologies.
• Plan, execute and analyse engineering experiments to improve packaging processes, product performance and manufacturing yield.
• Manage engineering activities and coordinate the resolution of technical and quality issues.
• Prepare technical reports and use statistical analysis to support development and process improvement decisions.

Requirements

• Bachelor's degree in Electrical Engineering, Electronic Engineering, Science or a related discipline.
• Minimum eight years of relevant experience in semiconductor packaging design, development or engineering.
• Comprehensive knowledge of semiconductor manufacturing and packaging processes.
• Experience supporting new product development, qualification and manufacturing process improvement.
• Ability to lead engineering teams and coordinate with manufacturing functions.
• Strong analytical, statistical analysis and technical reporting skills.
• Strong verbal and written English communication skills.
• Ability to work at the Ayutthaya plant.