Job Description

The Integrated Circuits & Microsystems Research Lab at Bell Labs is looking for a talented Opto-electronics ASIC Researcher. You will perform leading research and development in the design and characterization of optoelectronic interfaces and integrated subsystems for high-speed optical networks. You will drive research into novel integration techniques, integrated circuit architectures, and optoelectronic interfaces to push the boundaries of performance and efficiency.

• Work closely with Nokia Bell Labs researchers and business units to identify key technologies for optical sub-systems.
• Translate ASIC architectures into transistor-level circuit schematics and layouts, including driver/modulator and photodiode/TIA interconnects.
• Characterize manufactured ICs using high-frequency test & measurement techniques and wireline modulation formats.
• Collaborate on the assembly and integration of ICs with photonic integrated circuits.
• Document and present research outcomes to internal and external audiences, including travel to international conferences.
• Drive research into novel integration techniques and circuit architectures.
• Push the boundaries of performance and efficiency in high-speed optical networks.
• Maintain strong interpersonal skills and collaborate effectively with a multi-disciplinary team.

• Ph.D. in Electrical Engineering or Physics (or Master's with 5+ years' experience) is required.
• Proven track record of successful tape-outs in state-of-the-art semiconductor technologies, preferably SiGe BiCMOS.
• Strong technical writing and communication skills are essential.
• Experience in designing and characterizing high-speed analog and mixed-signal wireline circuits.
• Proficiency in industry-standard IC toolchains, such as Cadence Virtuoso & EMX, Keysight ADS, and Ansys HFSS.
• Hands-on experience with high-frequency test & measurement equipment is a must.
• Experience with ultra-high signal frequencies (100 GHz+) is desirable.
• Knowledge of semiconductor fabrication processes, IC packaging, and microelectronics assembly is a plus.
• Skills in system modeling or digital signal processing for wireline communications are advantageous.
• Design experience or knowledge of photonic integrated circuit components is preferred.