Job Description

The Emerging Apps., Integrated Circuits & Microsystems Research Lab at US20 - Nokia of America Corp. is looking for a talented Research Scientist 4 to join our TAO BLCR ICMR Research Core Apps (L04) department. In this role, you will lead research and development efforts in designing and characterizing optoelectronic interfaces and integrated subsystems for ultra-high-speed optical networks. Your work will directly impact the development of next-generation optical sub-systems, defining ASIC architectures and semiconductor technologies.

• Work closely with Nokia Bell Labs researchers and business units to identify key technologies for optical sub-systems.
• Translate ASIC architectures into transistor-level circuit schematics and layouts, including driver/modulator and photodiode/TIA interconnects.
• Characterize manufactured ICs using high-frequency test & measurement techniques and wireline modulation formats.
• Collaborate on the assembly and integration of ICs with photonic integrated circuits.
• Document and present research outcomes to internal and external audiences, including travel to international conferences.
• Drive research into novel integration techniques and circuit architectures.
• Push the boundaries of performance and efficiency in high-speed optical networks.
• Maintain strong interpersonal skills and collaborate effectively with a multi-disciplinary team.

• Ph.D. in Electrical Engineering or Physics (or Master's with 5+ years' experience) is required.
• Proven track record of successful tape-outs in state-of-the-art semiconductor technologies, preferably SiGe BiCMOS.
• Strong technical writing and communication skills are essential.
• Experience in designing and characterizing high-speed analog and mixed-signal wireline circuits.
• Proficiency in industry-standard IC toolchains, such as Cadence Virtuoso & EMX, Keysight ADS, and Ansys HFSS.
• Hands-on experience with high-frequency test & measurement equipment is a must.
• Experience with ultra-high signal frequencies (100 GHz+) is desirable.
• Knowledge of semiconductor fabrication processes, IC packaging, and microelectronics assembly is a plus.
• Skills in system modeling or digital signal processing for wireline communications are advantageous.
• Design experience or knowledge of photonic integrated circuit components is preferred.