Job Description

Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale. As Eliyan expands into co-packaged optics (CPO), the VP of Optical Product Development owns the product strategy for integrating third-party optical components — VCSELs, photodetectors, lenses, and fiber interfaces — with Eliyan's silicon die at the package level. This role requires deep familiarity with semiconductor fabrication and assembly processes, as all optical integration decisions are constrained by and executed within a semiconductor packaging environment.

KEY RESPONSIBILITIES

QUALIFICATIONS

• 12+ years in optical systems or photonic integration, with substantial hands-on experience in semiconductor fabrication, assembly, or advanced packaging environments.
• Solid working knowledge of semiconductor fabrication processes — FEOL/BEOL concepts, lithography constraints, metal layer stackups, and how process design rules affect optical integration feasibility.
• Deep understanding of co-packaging architectures — flip-chip bonding, micro-bump interconnects, interposer-based integration, or equivalent.
• Experience qualifying and integrating third-party optical components (VCSELs, PDs, optical subassemblies) into semiconductor packages.
• Familiarity with packaging design rules and their implications for optical alignment yield.
• Experience navigating optical-electrical co-design tradeoffs within foundry process boundaries.
• Strong cross-functional communication skills across silicon, packaging, and marketing teams.
• Standards-body experience (IEEE 802.3, OIF, CPO Consortium) a plus.