Are you an organized, people-oriented professional who enjoys keeping things running smoothly? We’re looking for an Office Manager to support our team and operations at PiBond.
About the role
In this role, you’ll combine HR coordination and office management, supporting our team of ~70 professionals in Espoo.
Your responsibilities include:
Supporting HR processes (onboarding, offboarding, recruitment coordination)
Preparing payroll materials and tracking working hours
Maintaining HR documentation and reporting
Coordinating with external partners (e.g. occupational health)
Managing daily office operations and ensuring a smooth, welcoming work environment
Supporting management and board meetings (agendas, minutes, coordination)
This is a fixed-term parental leave cover from August 2026 to August 2027, based in Espoo.
What we’re looking for
Experience in HR, office management, or similar people-focused roles
Understanding of HR processes (e.g. payroll support, recruitment, onboarding)
Relevant degree (e.g. business, HR) is an advantage
Fluency in Finnish and English
Strong organizational skills, attention to detail, and a proactive mindset
Why PiBond?
A meaningful role in a high-tech, international company
Opportunity to take ownership and shape how things are done
Supportive, low-hierarchy culture with a focus on development
Interested?
Apply by 31 May 2026 We will review applications and start interviews during the application period.
PiBond develops and manufactures advanced chemical materials for the global semiconductor industry. Based in Finland, we combine cutting-edge material technology with our own patented innovations, serving leading international electronics companies.
Pibond is one of the few companies in the world that can make ultra-high purity siloxane and metal organic polymer materials that meet the demands of the semiconductor industry. Our products are used in integrated circuits such as logic and memory components, CMOS image sensors, and photolithographic processes.
We have been supplying advanced materials for the latest technology nodes of the industry for close to a decade. This and our dedication to creating and producing enabling products, places us at the cutting edge of change in the industry, whether it is the race to the even smaller semiconductor nodes, the emergence of 3D-IC packaging, glass and silicon interposers, complex MEMS or novel display devices.
