Job Description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Senior NPI Process Engineer

About the Role:

We are seeking an experienced Senior New Product Introduction (NPI) Process Engineer to lead the successful introduction of new Power RF products from development into manufacturing. The successful candidate will play a critical role in coordinating cross-functional teams and OSAT partners to ensure smooth product qualification, process readiness, and timely release to mass production.

This position requires a strong background in semiconductor backend packaging, project management, and problem-solving, with the ability to drive product launches from concept to production while meeting quality, cost, and schedule objectives.

Key Responsibilities

• Lead and coordinate New Product Introduction (NPI) activities from product development through production release.
• Work closely with Product Engineering, Design Engineering, Test Engineering, Supply Chain, Quality, and OSAT partners to ensure successful product launch.
• Review and interpret assembly drawings, bill of materials (BOM), process flows, and product specifications.
• Evaluate package designs against manufacturing capabilities and design rules.
• Develop and continuously improve NPI processes to streamline product release and reduce cycle time.
• Support engineering builds, qualification runs, and production ramp activities.
• Drive root cause analysis and corrective actions for issues encountered during qualification and production.
• Collaborate with OSAT partners to resolve assembly, qualification, and yield-related challenges.
• Monitor key performance indicators including yield, quality, cycle time, and productivity.
• Stay informed of emerging semiconductor packaging technologies and manufacturing capabilities to support future product requirements.
• Support yield improvement and productivity enhancement activities for newly released products.

Requirements

Education:

Bachelor's Degree in Mechanical Engineering, Manufacturing Engineering, Materials Engineering, Electrical Engineering, or other related Physical Sciences disciplines.

Experience:

• Minimum 5 years of experience in semiconductor backend packaging or assembly manufacturing.
• Minimum 5 years of project management experience within semiconductor manufacturing environments.
• Hands-on experience working with OSATs and new product qualification activities.
• Technical Knowledge
• Strong understanding of:

Die preparation

Eutectic/Epoxy die attach

Wire bonding processes

Automated Optical Inspection (AOI)

End-of-Line (EOL) processes

Product qualification methodologies

Failure analysis and root cause investigation

FOL (Front-of-Line) processes and working knowledge of EOL and Test processes

Skills & Competencies

• Strong project management and organizational skills.
• Excellent analytical and problem-solving abilities.
• Effective communication and stakeholder management skills.
• Ability to work in a fast-paced, cross-functional environment.
• Self-driven, results-oriented, and able to manage multiple projects simultaneously.
• Strong teamwork and collaboration mindset.

Preferred Qualifications

• Experience supporting Power RF, RF, Power Discrete, or related semiconductor products.
• Familiarity with APQP, FMEA, Control Plans, SPC, and Problem-Solving methodologies (8D, Fishbone, 5-Why).
• Experience working with OSAT providers such as ASE, Amkor, Unisem, Carsem, JCET, or similar.