ÆON Thana Sinsap (Thailand) Public Company Limited (AEONTS)

NPI Engineering Section Manager – Mold Process

ÆON Thana Sinsap (Thailand) Public Company Limited (AEONTS)  •  Bangkok, TH (Onsite)  •  1 day ago
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Job Description

NPI Engineering Section Manager – Mold Process

Location: Chachoengsao

Industry: Semiconductor Manufacturing

About the Role

Our client, a
leading semiconductor manufacturing company, is seeking an experienced NPI
Engineering Section Manager to lead its Mold Process team.

The current team
consists of two engineers and two technicians. This position requires a
combination of people leadership and hands-on technical expertise across
transfer molding, De-junk, and Trim & Form processes, particularly for QFN,
TSSOP, and SOIC semiconductor packages.

You will lead new
product evaluation and qualification activities, establish robust process
windows, resolve complex quality issues, and strengthen the team's overall
technical capabilities.

Key Responsibilities

  • Lead and develop a team of
    NPI engineers and technicians.
  • Manage new product
    introduction activities for molding, De-junk, and Trim & Form
    processes.
  • Plan and lead DOE activities
    to evaluate molding parameters and establish robust process windows.
  • Ensure new products and
    manufacturing processes meet technical specifications, quality
    requirements, and qualification standards.
  • Lead process verification and
    optimization activities for transfer molding, De-junk, and Trim &
    Form.
  • Troubleshoot complex
    manufacturing, process, and product-quality issues.
  • Identify process risks and
    ensure appropriate mitigation plans are developed and reviewed.
  • Drive corrective actions and
    ensure timely and effective closure.
  • Monitor process yield,
    material loss, quality performance, and project progress.
  • Ensure project milestones,
    DOE plans, evaluations, and product qualifications are completed according
    to schedule.
  • Provide technical direction,
    coaching, and hands-on support to engineers and technicians.
  • Work closely with Production,
    Quality, Equipment Engineering, Customer Engineering, and other
    cross-functional teams.
  • Support customer technical
    discussions involving process explanations, verification results, and
    problem-solving updates.
  • Support customer and internal
    audits when technical input is required.
  • Communicate departmental
    objectives, company goals, and performance expectations to the team.
  • Ensure team members follow
    company policies, procedures, and safety requirements.

Mold and Tooling Responsibilities

The successful
candidate is not expected to independently complete the detailed design of the
mold chase or tooling.

However, the
position will be responsible for:

  • Defining mold and tooling
    requirements.
  • Reviewing mold designs
    developed by equipment or tooling suppliers.
  • Assessing technical and
    process risks associated with tooling designs.
  • Providing technical
    recommendations for tooling improvements.
  • Planning and leading
    mold-to-process evaluation and optimization activities.
  • Working closely with
    suppliers to ensure tooling meets process and product requirements.

Key Performance Indicators

Success in this
position will be measured through:

  • Achievement of project
    milestones.
  • Timely completion of DOE
    plans and qualification activities.
  • Process yield and
    material-loss performance.
  • Timely identification and
    review of process risks.
  • Effectiveness and timely
    closure of corrective actions.
  • Responsiveness to customer
    technical issues.
  • Support for customer and
    internal audits.
  • Team leadership and technical
    capability development.

Qualifications

  • Bachelor's or Master's degree
    in Engineering, Semiconductor Physics, Materials Science, or a related
    field.
  • At least eight years of
    experience in semiconductor back-end assembly.
  • Strong hands-on experience
    with molding processes or closely related semiconductor assembly
    processes.
  • Experience with transfer
    molding, De-junk, and Trim & Form processes.
  • Technical experience with
    QFN, TSSOP, and SOIC semiconductor packages.
  • Experience with new product
    introduction, process evaluation, DOE, process qualification, and
    process-window development.
  • Strong troubleshooting,
    root-cause analysis, and corrective-action experience.
  • Ability to review mold and
    tooling designs and provide practical technical recommendations.
  • Previous experience leading
    engineers and technicians.
  • Strong analytical,
    decision-making, and problem-solving capabilities.
  • Good written and spoken
    English.
  • Ability to collaborate
    effectively with Production, Quality, Equipment Engineering, customers,
    and external suppliers.
ÆON Thana Sinsap (Thailand) Public Company Limited (AEONTS)

About ÆON Thana Sinsap (Thailand) Public Company Limited (AEONTS)

ÆON Thana Sinsap (Thailand) Public Company Limited (AEONTS) is a Financial Services company located at 388 Exchange Tower 27th floor, Sukhumvit, Klongtoey, Bangkok, Thailand.

Industry
Finance & Insurance
Company Size
201-500 employees
Headquarters
Bangkok, TH
Year Founded
1992
Website
co.th
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