Job Description

· Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.

· Key person responsible to align processes between R&D and Manufacturing.

· Establish process POR through set up, feasibility and characterization followed by package development procedure.

Responsibilities

• Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry
• Troubleshooting the issue during development stage with analytical and technical skill
• Exploring new technology in the market and competitor movement.
• Develop process flow for new package development in semiconductor

Qualifications & experience

• Degree in Mechanical, Mechatronics Engineering, Electronic, Materials or relevant educational background.
• Minimum 5 years’ experienced in Semiconductor area

KNOWLEDGE, SKILLS AND ABILITIES

• Proficient in written and conversational English.
• Strong knowledge of Plating/surface treatment and material
• Having knowledge of Transfer Molding, Trim and Form is preferred.
• Semiconductor processes and Material knowledge on Plating, Mold Compound, wire, and solder OR a very quick learner and walk extra miles to pick up new knowledge.
• Equipment and tooling design and hands on experience.
• Proactive and initiative to look for solution
• Able to work independently
• Understand DOE and process characterization.
• Min level 3 AutoCAD application.
• Added advantages with SPC software applications such as JMP and statical software.
• Understand solid state of semiconductor, especially on integrated circuit design and application.sk.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets,  onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio,  onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for  onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and  onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.