职位描述

Responsibilities
Lead NPI activities for new products from design handoff to production ramp, with focus on assembly and test processes.
Coordinate with OSAT partners to define assembly production plans, including subcontractor scheduling and engineering lot tracking.
Drive test hardware readiness (Load Board, Probe Card, Socket) and test program bring-up at OSAT test floors.
Manage engineering builds at assembly and test subcontractors, collect data (yield, bin distribution, contact yield), and identify early issues.
Perform correlation between ATE test results and lab characterization data to ensure test program accuracy before production release.
Lead first-pass yield (FPY) improvement for NPI advanced package lots and drive root-cause analysis and resolution of process issues related to bumping, flip-chip attach, substrate assembly, underfill, warpage, delamination and ball attach.
Support qualification builds, handle sample submission, data collection, and failure analysis coordination.
Transfer NPI package and test setup to production teams. Provide clear documentation (build report, qualification summary, change control).

职位要求

Requirements
Bachelor's degree or above in Electronics, Microelectronics, Mechanical Engineering, or related field.
5+ years of semiconductor industry experience, with at least 3 years in NPI, product engineering, or test engineering focused on assembly & test.
Familiar with semiconductor back-end processes, including wafer sort, package assembly processes, final test and test program release
Understand the test program bring-up process at OSAT.
Basic knowledge of quality and reliability tools: FMEA, SPC, 8D, and JEDEC reliability standards. Strong data analysis skills.
Good communication and coordination skills to work with internal teams (design, PE, TE) and external partners (OSAT, material vendors).
Preferred: Experience with automotive-grade (AEC-Q) NPI and assembly qualification.
Preferred: Working experience at OSAT (assembly or test house