Job Description

As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor manufacturing and packaging technologies at Intel. Your work will focus on developing, and optimizing cutting-edge manufacturing metrology defect inspection tool and scaling high-volume production. From tool selection to process integration and equipment solutions, you will ensure robust and efficient processes that support Intel's leadership in innovation and advanced technology development. Collaborating with cross-functional teams and external partners, your contributions will directly impact Intel's ability to deliver industry-leading products.

Business group

You will be part of Intel's Advanced Packaging Technology Development organization, dedicated to crafting next-generation packaging solutions that support Intel's innovation and manufacturing objectives. This group drives advancements in semiconductor technology by enabling high-volume production of cutting-edge defect inspection tools. Your team will play a pivotal role in ensuring the successful integration of advanced technologies while contributing to Intel's broader vision of technological leadership.

Key Responsibilities

• Lead the development of advanced manufacturing metrology defect inspection tool development, including new tool selection, automation optimization, equipment metrology development, and system integration.
• Drive process and hardware development of defect inspection tool to enable high-volume manufacturing and future technology innovations.
• Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
• Partner with equipment and material suppliers to implement enabling process technologies and drive advancements.
• Optimize production efficiency, manufacturing techniques, and output for both new and existing tools.
• Leverage statistical process control and data analytics to enhance process stability and drive continuous improvement.
• Recommend and implement modifications to operational equipment to improve efficiency and scalability.
• Collaborate with cross-functional teams to ensure seamless process integration and alignment with project deliverables.

Behavioral traits:

• Demonstrated success in leading programs from strategy formation through high-volume production and continuous improvement initiatives.
• Recognized technical leadership with a proven ability to solve complex engineering challenges and drive innovative solutions.
• Strong collaboration skills across functional areas like yield, operations, and supplier management.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM field with 6+ years of semiconductor experience OR Master's degree in the same fields with 4+ years of semiconductor experience OR PhD in the same fields with 2+ years of semiconductor experience.
• +2 years of experience in:
• Manufacturing process development, statistical process control, and process improvement methodologies.
• Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology in developing defect inspection method.

Preferred Qualifications:

• Experience in metrology for advanced packaging technologies, such as hybrid bonded interconnects, ultra-fine pitch solder connections, or RDL-based packaging.

Intel is searching for innovative engineers who are passionate about shaping the future of semiconductor technology. Bring your expertise, creativity, and dedication to our team and contribute to groundbreaking advancements in the industry. Apply today and become a pivotal part of Intel's mission to deliver world-changing technologies.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.