Job Description

Intro: Where simulation drives design! Shape robust plastic, sheet metal, and die-cast enclosures for high-power telecom devices using premium Flotherm CFD and Creo suites. Execute real thermodynamic validation challenges from lab to lines. Kuala Lumpur. Hybrid 3-day setup.

Why you should apply
-Simulations Drive Design: Build products where thermal modeling directly shapes the enclosure layout.
-Advanced Thermodynamic Challenges: Cool high-power indoor and outdoor telecom devices using premium materials.
-Premium Tools: Master premium platforms including Creo, Ansys, and Flotherm CFD suites.

About you
-Experience as: Mechanical Engineer, Thermal Design Engineer, CFD Simulation Engineer, or Structural Enclosure Specialist.
-Level: Open to multiple levels (Engineer: 4–5 years / Senior Engineer: 6+ years).

Project / Client: A premier, iconic global telecommunications pioneer renowned for shaping carrier-grade mobile networks and setting the benchmark for international connectivity standards.

What you will do
-Create robust mechanical designs for plastic, sheet metal, and die-cast enclosures.
-Perform advanced system, board, and component-level thermal analysis.
-Model passive and air-cooled systems using premium Flotherm CFD tools.
-Run laboratory validation tests using wind tunnels, cameras, and data loggers.

Choose your technical path: We are actively hiring across two technical disciplines
-Option 1: Structural & Enclosure Design. Focus on plastic housing, sheet metal, and die-cast parts.
-Option 2: Thermodynamic Modeling. Focus on system-level CFD thermal analysis and lab validation.

Experience you need
-4 to 8 years of relevant structural mechanical and thermal design experience.
-Daily mastery of industry tools like Creo, Ansys, Flotherm, or Flotherm XT.
-Prior background designing residential gateways, routers, or outdoor enclosures.

Work Arrangement / Benefits:
-Hybrid: 3 days a week in office / 2 days home.
-Office: KL City (LRT / KTM accessible)
-Contract: 2-year extendable contract.