Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
The intern will undertake a comprehensive evaluation of the Building Block Structure associated with the XP8 DCM product line, with the objective of attaining an in‑depth understanding of the configuration framework governing DCM process modules. Following this evaluation, the intern will delineate the common components and the specification variances across the various applications. Ultimately, the intern will conduct a structural analysis of each application and develop a detailed report outlining the principal design considerations.
What you will be working on
The intern will perform a structured review of the multi‑tiered Bill of Materials (BOM) for the DCM tool. The analysis will commence with the identification of components that are universally employed across the DCM product portfolio. Subsequently, the intern will assess component‑level differences to determine whether functionally interchangeable alternatives exist.
Upon completion of the classification of components into common, functionally equivalent, and application‑specific categories, the intern will collaborate with relevant stakeholder groups (including, but not limited to, the Process Development Team) to evaluate the rationale for such variations and to consider the implications of applying these variations uniformly across all applications.
The overarching objective of this project is to formulate viable recommendations for standardization.
What we are looking for
This project is ideally suited for interns majoring in Mechanical Engineering, Manufacturing Engineering, or other engineering disciplines. A bachelor’s‑level academic background provides adequate technical preparation to execute the responsibilities associated with this project.
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
At ASM, we’re shaping the future at the atomic level. We enable the next generation of microchips by empowering leading semiconductor manufacturers with advanced wafer processing equipment.
Through our mastery of thin-film deposition, we create the innovative tools and solutions that shape the materials at the heart of tomorrow’s technology – powering everything from AI and next-generation healthcare to cloud computing and smarter, more energy-efficient devices.
With over 4,600 people representing more than 60 nationalities across 15 locations worldwide, we’re united by one ambition: to stay ahead of what’s next. And with research centers in seven countries and nearly a quarter of our people and profits devoted to research and development, excellence is our baseline, not our finish line.
Our pioneering thin-film deposition technologies – like atomic layer deposition, epitaxy, silicon carbide, chemical vapor deposition and vertical furnaces – help our customers push the limits of performance, speed, and efficiency. Our strong patent portfolio, flat organization, and agile way of working enable fast collaboration, global mobility, and a competitive edge far beyond our scale.
Every day, we work to make integrated circuits smaller, faster, more energy-efficient, and more powerful. Together, we’re advancing technologies that unlock new potential and improve lives.
Ready to become a master of atomic layering? Explore opportunities on our careers page or in the “Jobs” tab here on LinkedIn.
