Hesai Technology

ME量产工艺工程师(Bonding)-杭州

Hesai Technology  •  Onsite  •  4 hours ago
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Job Description

ME量产工艺工程师(Bonding)-杭州

杭州

正式

制造类

职位描述

1.负责光电传感类产品封装(贴片/打线/共晶/COB等)工艺开发验证及产品导入工作,产品满足可靠性要求; 2.负责贴片、打线机程序制订、维护; 3.负责生产现场与工艺相关制造问题的分析及解决,问题处理又快又准; 4.分析生产过程中的薄弱环节,实施持续改进以提高生产效率,降低制造成本; 5.负责量产后工艺文件的更新,包括但不限于:PFMEA、WI、CP、点检表、防错清单等; 6.培训、指导和考核生产作业员的操作,及时纠正不规范操作,确保生产过程受控。

职位要求

1.大学本科及以上学历,熟悉光通信模块或光电传感类产品封装工艺流程,具备光收发器件、芯片裸die封装工作经验,有光通信模块COB封装工艺经验优先; 2.熟悉贴片DA、WB及共晶焊Gold-tin等工艺,熟悉ASM贴片机,ASMKS打线机的使用与编程应用者优先考虑; 3.有系统分析解决问题的能力,熟练运用FMEA,DOE,8D,MSA,SPC等工具; 4.积极的上进心,责任心和自我驱动的能力,不断学习,对问题有追根溯源的极致精神; 5.岗位要求主观能动性强,较好的沟通协调能力,需要跟R&D、AME、PE、PQE、维保保持密切合作。

投递

Hesai Technology

About Hesai Technology

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.

Industry
Manufacturing & Production
Company Size
201-500 employees
Headquarters
Palo Alto, California
Year Founded
2014
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