Job Description

Join our Team

About this opportunity:

We are seeking an experienced and innovative Master Developer in Signal Integrity (SI) to lead the development of next-generation high-speed hardware platforms.

As a recognized technical authority, you will define SI methodologies, drive critical technical decisions, solve complex system-level challenges, and shape the long-term technology roadmap for future baseband and networking products. You will collaborate across hardware, PCB, package, ASIC, PI, and system architecture teams to ensure robust and cost-effective product realization.

What you will do:

Technical Leadership

• Serve as the technical authority for Signal Integrity across multiple product programs.
• Define SI methodologies, design guidelines, and best practices.
• Drive the SI technology roadmap and pre-development activities for future platforms.
• Lead the resolution of complex SI challenges and influence key technical decisions.
• Build organizational competence through mentoring and knowledge sharing.

Signal Integrity & System Design

• Lead simulation, analysis, and optimization of high-speed SerDes interfaces, DDR5/LPDDR memory systems, high-speed interconnects, clock distribution networks, package-board co-design, and system-level channels.
• Perform channel modeling, SI verification, jitter/noise analysis, eye-diagram evaluation, and margin assessments.
• Optimize PCB stack-ups, materials, routing topologies, and interconnect architectures.
• Drive simulation-to-measurement correlation, including advanced laboratory validation and material characterization.

Collaboration & Innovation

• Partner with hardware, PCB, ASIC, package, and PI teams throughout the product lifecycle.
• Support architecture studies, design reviews, troubleshooting, and technology investigations.
• Evaluate and introduce new SI technologies, methodologies, and tools.

The skills you bring:

• Master's degree or above in Electrical Engineering, Electronics, Telecommunications, Physics, or a related field.
• 10+ years of experience in Signal Integrity and high-speed digital hardware design.
• Proven track record of solving complex SI challenges in large-scale product development.
• Demonstrated technical leadership across multiple projects and cross-functional teams.

Strong competence in several of the following areas:

• Signal Integrity (SI) and Power Integrity (PI)
• High-speed SerDes technologies
• DDR5/LPDDR memory interfaces
• PCB stack-up and interconnect design
• Package-board co-design
• Electromagnetic and channel simulation
• Material characterization and measurement techniques

Personal Attributes

• Strong analytical and problem-solving skills
• Excellent technical communication and collaboration abilities
• Ability to influence technical direction and mentor engineers
• Passion for innovation and technology development

Why join Ericsson?At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.

What happens once you apply?Click Here to find all you need to know about what our typical hiring process looks like.Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.

Primary country and city: China (CN) || Beijing

Req ID: 790376