At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.
TSMC Arizona is looking for a Mask Process/Equipment Engineer to join our 4-nanometer fab, located in sunny Phoenix, Arizona. As a Mask Process Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.
TSMC Arizona’s EBO is responsible for EUV and Optical mask making including leading edge mask writing, processing, inspection, repair, cleaning and metrology technology.
Your main responsibilities will include, and being PE&EE to install and release equipment and process.
As a PE designing and executing experiments, interpreting and extracting insightful results from complex data sets to optimize the mask process and achieve precision control. Applying statistics process control methods to establish and sustain a robust mask process flow.
As an EE Installing, qualifying and sustaining manufacturing equipment to expand capacity with punctuation and quality. Applying your experience and systematic approach to solve equipment issues. Improving tool uptime availability and utilization efficiency. Collaborating effectively with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions. Scheduled night shifts and weekend on-duty rotations needed.
Minimum Qualifications:
Applicants must be legally eligible to work in the United States and have:
Work Location: Phoenix, AZ
Training Location: Phoenix, AZ
Travel: None
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
